IR Thermal Microscope (QFI)

IR Thermal Microscope (QFI) Tool Type Inspection, Test and Characterization Location Bay 2 Supervisor Brian Lingg Supervisor Phone (805) 893-8145 Supervisor E-Mail lingg_b@ucsb.edu Description QFI Labwalker Failure Analysis System Manufacturer QFI Sign up for this tool

About

1. The InfraScope "HotSpot" software is a fault isolation tool for semiconductor failure analysis. The InfraScope detects thermal infrared photons emitted from hot areas on semiconductor circuits. Such hot spot sites often mark the location of a process fault or damaged location of a circuit, such as a short circuit. The MWIR cameral operates at 2um - 4um wavelength.
2. The "Emmi" software detects photons emitted from electron-hole recombination sites on semiconductor circuits. Such recombination sites often mark the location of a process fault or damaged location of a circuit. The NIR cameral operates at 400nm - 1,000nm wavelength.
3. The "Thermal Map" software allows the user to perform temperature mapping of materials and devices. The user easily determines the exact temperature at any point by color or by simply positioning the mouse arrow over the desired point and reading the desired temperature. This technique saves literally hundreds of hours over non-infrared techniques and it doesn't damage or affect the part in any way.

The tool is fitted with a 6 inch heated chuck, micrometer probes, dark box, and dual Keithley DC power supplies. 0-200VDC & 0-1000VDC. Users may bring their own power supplies as needed for their specific devices and material testing. The tool has better than 2.7µm resolution.

Manuals & Software

• QFI Infrascope User Manual
• Offline analysis software is available for the ThermalMap and HotSpot tools. Email Brian Lingg for access.