Wafer Bonder (Logitech WBS7)
From UCSB Nanofab Wiki
Revision as of 23:02, 22 August 2018 by
John d
(
talk
|
contribs
)
(John d moved page
Wafer Bonder (Logitech WSB7)
to
Wafer Bonder (Logitech WBS7)
: Correct erroneous model number)
(
diff
)
← Older revision
|
Latest revision
(
diff
) |
Newer revision →
(
diff
)
Jump to navigation
Jump to search
Wafer Bonder (Logitech WBS7)
[[image:|300x350px|center|]]
Tool Type
Thermal Processing
Location
Bay 5
Supervisor
Don Freeborn
Supervisor Phone
(805) 893-7975
Supervisor E-Mail
dfreeborn@ece.ucsb.edu
Description
Wafer Bonder WSB7
Manufacturer
Logitech
About
Detailed Specifications
Operation Procedures
Categories
:
NOID
Tools
Thermal Processing
Navigation menu
Personal tools
Create account
Log in
Namespaces
Page
Discussion
English
Views
Read
View source
View history
More
Search
InvisibleMenu
QuickLinks
Lab Rules
Common Questions/FAQ
Staff List
Equipment Signup
Chemicals + MSDS
Equipment
Full Tool List
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
Packaging
Metrology & Test
Recipes and Data
Lithography
Vacuum Deposition
Dry Etching
Wet Etching
Thermal Processing
Packaging Tools
Data + Info
Process Control Data
Calculators/Utilities
NanoFab Info
Research + Pubs
Tech Talks
Tools
What links here
Related changes
Special pages
Printable version
Permanent link
Page information