Wafer Bonder (Logitech WBS7)

From UCSB Nanofab Wiki
Revision as of 23:02, 22 August 2018 by John d (talk | contribs) (John d moved page Wafer Bonder (Logitech WSB7) to Wafer Bonder (Logitech WBS7): Correct erroneous model number)
Jump to navigation Jump to search
Wafer Bonder (Logitech WBS7)
[[image:|300x350px|center|]]
Tool Type Thermal Processing
Location Bay 5
Supervisor Don Freeborn
Supervisor Phone (805) 893-7975
Supervisor E-Mail dfreeborn@ece.ucsb.edu
Description Wafer Bonder WSB7
Manufacturer Logitech


About

Detailed Specifications

Operation Procedures