ASML Stepper 3 Error Recovery, Troubleshooting and Calibration
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Wafer Recovery
See the Wafer Recovery page for procedure on how to recover from an error and get your wafers back.
Error Log full
- Close logging window
- Open new console window: Rt click on Desktop, select (ASML)
- At % prompt, type logging (all lowercase!)
- Resize window and place in upper right area of screen as normal.
Wafer Handler Issues during Batch operation
- Make sure no Batches are Running or Waiting! Abort the Batch or Stop the Queue.
- Never exit the Task Streaming screen while Batches are incomplete/running, you will enter software limbo on infinite loop drive, requiring a software restart.
- Lift black cover behind keyboard
- Press AWH button for 1 sec and release (resets Wafer Handler)
- Wait until wafer handler “system booting” message is done and warning window in bottom left of main computer console has disappeared. Log window should say it booted succesfully. Takes a few minutes.
- (DO NOT do FAST STARTUP from error message, go to main menu!)
- Exit to main menu
- Go to Start/Stop
- Fast Startup
- Start - will reinitialize the wafer handler system
- Once complete, back to main menu
- If wafers in machine, go to material handler (Mat Hdl).
- Go to Remove Wafers menu and Collect Wafers
- Back to main menu when finished.
- If system says wafer is missing, contact engineer
IQC (Image Quality Control) Calibration Check
- Main Menu > Test Manager > Run Tests > Metrology Verification > Image Quality Control
- Accept (Upper Button)
- Perform Measurement
- Choose System Correction
- # Cycles = 1
- # Measurements = 3
- # Corrections = 1
- M "Measure" mode only (does Not update internal lookup tables)
- (UCSB numbers for test 1 3 1 M)
- Accept to run the test
- If | focus correction | < 50nm, system OK, note number in log book
- If | focus correction | > 50nm, run test again, if number keeps dropping, keep running until number stable
- If | focus correction | is still > 50nm, discuss with engineer
Laser Refill (or laser calling for gas injection)
- Main Menu > Test Manager
- Open Cmd Handler (Cmd Hdl) (Top Menu)
- Illumination and Projection > Illumination
- Use Laser Start if laser asking for gas injection, otherwise do New Laser Fill
- Illumination and Projection > Illumination
Failed Alignment Marks - Choosing new alignment marks for Pre-Alignment
If your job aborted with "Alignment failure" on the E- or P-Chuck, because your alignment marks are damaged, this is how to edit your job to use different alignment marks.
- Edit your job with Modify Job
- Go to Layer Layout > Process Data
- Use Layer: (Prev) / (Next) to select the layer you need to change alignment marks for
- Under Prealignment Mode: Selection: Mark 1___ & Mark 2___ choose the alignment marks to align to, and use a microscope to make sure these alignment marks are (a) present on your wafer and (b) look ok with no defects.
- The wafer schematic shows which alignment marks you are choosing.
- The alignment marks, defined on a previous layer (usually combined with the first litho), are programmed/named in: <to be added: where in the program the AlMks are defined>
- Your "Fine" alignment marks will probably also fail if they're set to use the same marks! Fix this by editing your Wafer Layout > Alignment Strategy, and select different alignment marks or set some "backup" marks. Make sure your Layer Layout > Strategy Selection is using this new/updated strategy.