Dry Etching Recipes
|
|
RIE Etching
|
ICP Etching
|
Oxygen Plasma Systems
|
Other Dry Etchers
|
Material
|
RIE 2 (MRC)
|
RIE 3 (MRC)
|
RIE 5 (PlasmaTherm)
|
DSEIII (PlasmaTherm)
|
SLR Fluorine ICP (PlasmaTherm)
|
ICP Etch 1 (Panasonic 1)
|
ICP Etch 2 (Panasonic 2)
|
ICP-Etch (Unaxis VLR)
|
Ashers (Technics PEII)
|
Plasma Clean (Gasonics 2000)
|
Plasma Clean (YES EcoClean)
|
UV Ozone Reactor
|
Plasma Activation (EVG 810)
|
XeF2 Etch (Xetch)
|
Vapor HF Etch (uETCH)
|
CAIBE (Oxford)
|
Ag
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A
|
Al
|
|
|
A
|
|
|
R1
|
R1
|
|
|
|
|
|
|
|
|
A
|
Au
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
R
|
Cr
|
|
|
A
|
|
|
R1
|
A
|
|
|
|
|
|
|
|
|
A
|
Cu
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A
|
Ge
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A
|
|
A
|
Mo
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A
|
Ni
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
R1
|
Pt
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
R1
|
Ru
|
|
|
|
|
|
A
|
R1
|
|
|
|
|
|
|
|
|
A
|
Si
|
|
|
|
R1
|
R1
|
|
|
|
|
|
|
|
|
R1
|
|
A
|
Ta
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A
|
Ti
|
|
|
|
|
|
R1
|
A
|
|
|
|
|
|
|
|
|
A
|
Al2O3
|
|
|
|
|
|
|
R
|
|
|
|
|
|
|
|
|
A
|
Al2O3 (Sapphire)
|
|
|
|
|
|
R1
|
A
|
|
|
|
|
|
|
|
|
A
|
AlGaAs
|
|
|
R1
|
|
|
R1
|
|
GaAs-AlGaAs Etch (Unaxis VLR)
|
|
|
|
|
|
|
|
A
|
AlGaN
|
|
|
|
|
|
|
|
R1
|
|
|
|
|
|
|
|
A
|
AlN
|
|
|
|
|
|
|
|
R1
|
|
|
|
|
|
|
|
A
|
CdZnTe
|
R1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A
|
GaAs
|
|
|
R1
|
|
|
R1
|
R1
|
GaAs-AlGaAs Etch (Unaxis VLR)
|
|
|
|
|
|
|
|
A
|
GaN
|
|
|
R1
|
|
|
R1
|
|
R1
|
|
|
|
|
|
|
|
A
|
GaSb
|
|
|
|
|
|
|
A
|
GaSb Etch Unaxis VLR)
|
|
|
|
|
|
|
|
A
|
HfO2
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A
|
InGaAlAs
|
InP-InGaAsP-InGaAlAs Etching (RIE 2)
|
|
|
|
|
|
|
InP-InGaAs-InAlAs Etch (Unaxis VLR)
|
|
|
|
|
|
|
|
A
|
InGaAsP
|
InP-InGaAsP-InGaAlAs Etching (RIE 2)
|
|
|
|
|
|
|
InP-InGaAs-InAlAs Etch (Unaxis VLR)
|
|
|
|
|
|
|
|
A
|
InP
|
InP-InGaAsP-InGaAlAs Etching (RIE 2)
|
|
|
|
|
A
|
A
|
InP-InGaAs-InAlAs Etch (Unaxis VLR)
|
|
|
|
|
|
|
|
R
|
ITO
|
R1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A
|
Photoresist
& ARC
|
|
A
|
R
|
|
|
R
|
R
|
|
A
|
A
|
A
|
|
|
|
|
A
|
SiC
|
|
|
|
|
|
R1
|
A
|
|
|
|
|
|
|
|
|
A
|
SiN
|
|
SiNx Etching (RIE 3)
|
|
|
|
R1
|
R1
|
|
A
|
|
|
|
|
|
|
A
|
SiO2
|
|
SiO2 Etching (RIE 3)
|
|
|
A
|
R1
|
R1
|
|
|
|
|
|
|
|
R1
|
A
|
SiOxNy
|
|
|
|
|
|
A
|
A
|
|
|
|
|
|
|
|
|
A
|
Ta2O5
|
|
|
|
|
|
|
A
|
|
|
|
|
|
|
|
|
A
|
TiN
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A
|
TiO2
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A
|
W-TiW
|
|
|
|
|
|
R1
|
A
|
|
|
|
|
|
|
|
|
A
|
ZnO2
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A
|
ZnS
|
R1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A
|
ZnSe
|
R1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A
|
ZrO2
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A
|
Material
|
RIE 2 (MRC)
|
RIE 3 (MRC)
|
RIE 5 (PlasmaTherm)
|
DSEIII (PlasmaTherm)
|
SLR Fluorine ICP (PlasmaTherm)
|
ICP Etch 1 (Panasonic E626I)
|
ICP Etch 2 (Panasonic E640)
|
ICP-Etch (Unaxis VLR)
|
Ashers (Technics PEII)
|
Plasma Clean (Gasonics 2000)
|
Plasma Clean (YES EcoClean)
|
UV Ozone Reactor
|
Plasma Activation (EVG 810)
|
XeF2 Etch (Xetch)
|
Vapor HF Etch (uETCH)
|
CAIBE (Oxford)
|