S-Cubed Flexi - Operating Procedure

Work In Progress This article is still under construction. It may contain factual errors. Content is subject to change.

Only staff & designated maintenance users are allowed to write recipes on this tool!  
Maintaining low particle counts on this tool is extremely important, so users must strictly follow the training procedures. The Underside of your wafers must be clean to avoid contamination!

Processes currently available to lab users:

• DS-K101 BARC (can be used like DUV42P)
  • See this table of develop rate vs. bake temp for DS-K101
• UV6 Positive DUV Resist
  • Various spin speeds available.
• (PMGI and PMMA not yet available for general use)

Initial

• Make sure system is not running a process - Lot view shows no wafers or batches running.

• Check liquid supplies
  • Check PR + EBR bottles by weight (lift by hand).  Replace EBR if needed, just unscrew and put into new bottle. If PR bottle empty (see large bubbles in tube) let TonyB/SeanD know, not user replaceable.

(If running PMGI, check if nozzles cleaned)

• Check PR nozzle "bath" - make sure it's not clogged (should have a bit of liquid, but not above drain hole).  If it does, use wooden stick of swab to unclog.

• Check if hot plates are set to the needs temperatures. If not, run Temp-change recipe:

1. Load dummy wafer (clean underside)
2. run recipe: Staff>SET-<HP#>-<TEMP> recipe corresponding to needed temp.
   1. Eg. Staff > SET-HP4-220C will set hotplate 4 to 220°C
3. Check that hotplate reach desired temp.(will overshoot by ~2-3°C)
4. After 5min bake, need +/-2°C before running process.

Run Wafers

• Load test "mechanical" wafer - run a test run of your desired recipe, make sure spin looks ok.  Important for first UV6 run after >6hrs idle.  1st Mechanical wafer will likely show radial nonuniformity as dried PR is ejected.  2nd test wafer should spin with high uniformity.

• Load your wafers into Left Cassette, run your Route.  Use filter ONLY [Staff].

Allowed Recipes

Ask Staff if you need a new recipe.

Coating Material	Route/Chain	Name	Spin Speed	Bake Temp	Notes
DS-K101	Route	Coat-DS-K101-304[5Krpm]-185C			Requires: HP4=185°C • DSK Bake vs. Dev rate
UV6-0.8	Route	Staff > Coat-UV6[3.5K]-135C	3.5krpm	135°C	Requires: HP1=135°C
DS-K101 + UV6	Chain	Staff > Coat-DSK101[5K]-220C-UV6[3.5K]-135C	DSK: 5krpm UV6: 3.5krpm	DSK: 220°C UV6: 135°C	Requires: – HP4=220°C – HP1=135°C Plan for ~10-15 min per wafer.
Hotplate Set	Route	SET-HP4-220C			Hotplate 4 (top) between 218-222°C when done.

NEVER RUN DEVELOPER RECIPES on this machine!

The developer recipes are prone to damage the hardware if not handled correctly - system is NOT AVAILABLE for automated develop at this time.