File:2026 CSMANTECH Paper-2366 - Foong Fatt - Machine Matching Methodology for Single-shot Lab to Lab Dry Etch Process Transfer.pdf
2026_CSMANTECH_Paper-2366_-_Foong_Fatt_-_Machine_Matching_Methodology_for_Single-shot_Lab_to_Lab_Dry_Etch_Process_Transfer.pdf (file size: 1.74 MB, MIME type: application/pdf)
Summary
Machine Matching Methodology for Single-shot Lab to Lab Dry Etch Process Transfer Fatt Foong, Brian Thibeault, Noah Dutra, Demis D. John, Vraj Mehalana, Chandan Ramakrishnaiah, Shivakumar Bhaskaran, Jacky Tseng, Shimin Huang, Michio Aruga, Weldom Xie, Bokai Ma, Jeongho Ha, John Tamelier, Fubo Rao
Conference: CS MANTECH
Year: 2026
Topics
Process Transfer Compound Semiconductors GaAs Design of Experiments InP Dry Etch Nanofabrication Abstract
Small start-up companies benefit significantly from leveraging low-cost, quick-turnaround university nanofabrication facilities for developing next-generation compound semiconductor devices and prototypes. This paper presents a methodology for establishing dry etch process transfer between different fabrication facilities using machine matching and complementary design of experiments, demonstrating successful transfer of etch recipes across different systems.
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| Date/Time | Dimensions | User | Comment | |
|---|---|---|---|---|
| current | 15:55, 22 August 2026 | (1.74 MB) | John d (talk | contribs) | Machine Matching Methodology for Single-shot Lab to Lab Dry Etch Process Transfer Fatt Foong, Brian Thibeault, Noah Dutra, Demis D. John, Vraj Mehalana, Chandan Ramakrishnaiah, Shivakumar Bhaskaran, Jacky Tseng, Shimin Huang, Michio Aruga, Weldom Xie, Bokai Ma, Jeongho Ha, John Tamelier, Fubo Rao Conference: CS MANTECH Year: 2026 Topics Process Transfer Compound Semiconductors GaAs Design of Experiments InP Dry Etch Nanofabrication Abstract Small start-up companies benefit significantly... |
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