Maskless Aligner (Raith PicoMaster XF)

From UCSB Nanofab Wiki
Revision as of 20:07, 30 September 2026 by John d (talk | contribs) (fixed links to recipes, deleted some MLA links etc)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search
Maskless Aligner (Raith PicoMaster XF)
File:XYZ.jpg
Location Bay 6
Tool Type Lithography
Manufacturer Raith Gmbh
Model Picomaster XF 200
Description Direct-Write (Maskless) I-Line Photolithography

Primary Supervisor Biljana Stamenic
(805) 893-4002
biljana@ece.ucsb.edu

Secondary Supervisor

Lee Sawyer


Materials I-Line Photoresists
Recipes

SignupMonkey: Sign up for this tool


Instructions + Procedures

Sign Up

Get Trained

Maintenance
Messages
Report Issue



Work In Progress

This article is still under construction. It may contain factual errors. Content is subject to change.


About

The Raith PicoMaster XF 200 allows for arbitrary direct-write patterning of I-Line photoresists from an uploaded CAD drawing/file (GDS, DXF, CIF etc.). The system uses a Grating Light Valve ("GLV") for patterning the exposure light-field, to programmatically expose digitized patterns directly onto the sample - no glass photomasks/reticles are required.

Depending on the exposure options and write area, the PicoMaster is able to expose a 100mm wafer in about 60min, and achieves minimum features sizes around 0.5µm, with overlay/alignment accuracy better than 200nm.


Detailed Specifications


Work In Progress

This article is still under construction. It may contain factual errors. Content is subject to change.


  • Maximum Writeable Area: TBD
  • Substrate size: 200mm round down to 1cm pieces
  • Wafer / substrate thickness: Max. / Min. TBD
  • Exposure optics:
  • Alignment Accuracy: Global ≤ 500nm; Local ("Field") ≤ 250nm
  • Linewidth variation: ≤100nm (relevant to stitched exposure fields)
  • Minimum Features: ~0.40µm line/space demonstrated with 0.5µm-thick PR. Requires additional effort. ≥1µm is relatively straightforward.
  • Write Grid (Address Unit): TBD
  • Additional manufacturer options:
    • Backside alignment

Operating Procedures


Work In Progress

This article is still under construction. It may contain factual errors. Content is subject to change.


Standard Operating Procedures


Training Procedure

To get authorized on this tool:

Request Training


Design Info - CAD layout


Work In Progress

This article is still under construction. It may contain factual errors. Content is subject to change.


Recipes


Work In Progress

This article is still under construction. It may contain factual errors. Content is subject to change.


Calibrate your own Litho process

Litho. recipes for all our photolith. tools can be found on the Photolithography Recipes page.