Difference between revisions of "Dicing Saw (ADT)"
Jump to navigation
Jump to search
(Text replacement - "/wiki/index.php" to "/w/index.php") |
(Updated SOP Rev) |
||
| Line 10: | Line 10: | ||
|toolid=49 | |toolid=49 | ||
}} | }} | ||
| − | == About | + | ==About== |
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock. | The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock. | ||
| Line 17: | Line 17: | ||
Contact the tool supervisor for blades and dicing frames for your group. | Contact the tool supervisor for blades and dicing frames for your group. | ||
| − | == Detailed Specifications == | + | ==Detailed Specifications== |
| − | == Operating Procedures == | + | ==Operating Procedures== |
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| + | *[https://wiki.nanotech.ucsb.edu/w/images/5/57/ADT_SOP_Rev_D.pdf ADT Dicing Saw Standard Operating Procedure] | ||
| + | *[[ADT 7100 - Initial Setup Before Cutting|Setting up the Saw before Cutting]] - Disregard and refer to SOP above | ||
| + | *[[ADT 7100 - Standard Dicing Procedure - Programmed Cut Map|Standard Dicing Procedure - Programmed Cut Map]] | ||
| + | *[[ADT 7100 - Standard Dicing Procedure - Single Cuts|Standard Dicing Procedure - Single Cuts]] | ||
| + | *[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]] | ||
| + | |||
| + | |||
| + | ==Recipes== | ||
| + | |||
| + | *Recipes > Packaging > [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 '''Dicing Saw Recipes (ADT 7100)'''] | ||
| − | |||
| − | |||
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting. | Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting. | ||
Revision as of 12:40, 9 September 2021
|
About
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.
Contact the tool supervisor for blades and dicing frames for your group.
Detailed Specifications
Operating Procedures
- ADT Dicing Saw Standard Operating Procedure
- Setting up the Saw before Cutting - Disregard and refer to SOP above
- Standard Dicing Procedure - Programmed Cut Map
- Standard Dicing Procedure - Single Cuts
- Recovering an Old Recipe
Recipes
- Recipes > Packaging > Dicing Saw Recipes (ADT 7100)
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.