Difference between revisions of "Film Stress (Tencor Flexus)"

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|type = Inspection, Test and Characterization
|type = Inspection, Test and Characterization
|super=Mike Silva
|super= Lee Sawyer
|location=Bay 4
|location=Bay 4

Revision as of 11:13, 15 April 2020

Film Stress (Tencor Flexus)
Tool Type Inspection, Test and Characterization
Location Bay 4
Supervisor Lee Sawyer
Supervisor Phone (805) 893-2123
Supervisor E-Mail lee_sawyer@ucsb.edu
Description Film Stress Measurement system
Manufacturer Tencor
Model FLX-2320


The Flexus instrument is used to measure the stress introduced onto a wafer after thin-film deposition by measuring local curvature of a wafer. The system uses a scanning laser detector configuration to measure the surface position of a wafer across its diameter. With automatic rotational control, a 3-D map can also be obtained. By comparing before and after measurements of the sample, the local stress of the sample can be calculated from the local curvature. The stage can also be heated up to 500°C to measure thermal mismatch of the thin films with the substrate.

Equipment Specifications

  • RT to 500°C operation
  • Windows 3.xx control and file storing
  • 3-D mapping
  • 4" wafers
  • Laser/Detector Scanning Configuration