Lift-Off with I-Line Imaging Resist + LOL2000 Underlayer
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Tips
Please see our Bi-Layer Lift-Off Tutorial to understand the limitations and requirements for good lift-off.
- Remember that the PR protecting the gaps between adjacent metal traces can lift-off during the develop!
- Need underlayer thickness approx. 2x the desired metal thickness.
- The underlayer will develop laterally from both sides which can lift-off the imaging resist, so:
- Minimum gap between adjacent metals should then be: greater than 0.5 * underlayer thickness
- Want at least 30-50nm of underlayer width left to support the imaging resist, so the PR doesn't fall over/collapse.