Difference between revisions of "Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick"
Jump to navigation
Jump to search
(updated open/close procedure) |
(clean glass plate if wax present) |
||
Line 36: | Line 36: | ||
* Process takes about 45min |
* Process takes about 45min |
||
** Unload when it displays ''Status: Ready'' |
** Unload when it displays ''Status: Ready'' |
||
+ | * If wax leaked onto the glass plate: remove glass plate and clean with Acetone+Wipe. |
||
* Turn off Logitech bonder (bottom right of machine chassis) |
* Turn off Logitech bonder (bottom right of machine chassis) |
||
** Close lid and clamp |
** Close lid and clamp |
Revision as of 11:23, 11 August 2020
Contributed by Miguel Daal, Mazin Group -- 2018-04-24
Procedure for wax-mounting a 100mm Silicon wafer to another 100mm silicon carrier wafer.
- Place 4" polished handle wafer on hotplate set to 120°C
- Apply wax to center of wafer only, approximately 2-inch diameter size puddle of crystal bond wax directly from the crystalbond stick.
- Need a good amount of wax to ensure coverage to wafer edges, eg.2-3mm thick.
- Then remove from hotplate. and cool.
- Open Bonder chamber:
- Unscrew clamp until higher than clamp arm,
- Swing front of clamp arm to the left (Difficult to disengage),
- Lift bonder lid (also takes some force to open - ignore vacuum reading on digital display)
- On the glass plate of the Logitech bonder:
- Align work wafer on top of handle wafer placed.
- Align the two wafers' flats.
- Place 6" piece of filter paper on top of work wafer.
- Turn on Logitech bonder power (bottom right of machine chassis)
- Close and lock Logitech bonder hatch.
- On front panel of Logitech bonder, confirm that Applied Pressure gauge is set to 5 psi.
- Enter the process settings:
- [setup] -> [Temp]
- Bonding: 120°C
- Endpoint: 65°C
- Offset: 20°C
- Units: C
- [setup] -> [Vac Thres]
- Proceed if Below: 2.4E+01 mBar
- Abort if Below: 3.2E+01 mBar
- [setup] -> [Process Control]
- Process: Heat + Outgas
- Soak: 5min
- Bond: 15min
- O.G. Limit: 20min
- P.P. del: 1min
- [Setup] -> [Heads]
- Head 1 On
- [setup] -> [Temp]
- Start Process: [Process] -> [Start]
- Process takes about 45min
- Unload when it displays Status: Ready
- If wax leaked onto the glass plate: remove glass plate and clean with Acetone+Wipe.
- Turn off Logitech bonder (bottom right of machine chassis)
- Close lid and clamp