Maskless Aligner (Heidelberg MLA150)

From UCSB Nanofab Wiki
Revision as of 14:26, 28 September 2020 by John d (talk | contribs) (→‎About: updated some specs)
Jump to navigation Jump to search

Work In Progress

This article is still under construction. It may contain factual errors. Content is subject to change.

Maskless Aligner (Heidelberg MLA150)
Tool Type Lithography
Location Bay 6
Supervisor Biljana Stamenic
Supervisor Phone (805) 893-4002
Supervisor E-Mail
Description Maskless I-Line Photolithography
Manufacturer Heidelberg Instruments
Model MLA150
Materials I-Line Photoresists


The MLA150 allows for arbitrary direct patterning of I-Line photoresists, directly from a CAD drawing/file, with alignment to arbitrary features on the sample. The system uses a digital micromirror device ("DMD", an array of MEMS mirrors) for patterning the exposure light-field, to programmatically expose digitized patterns directly onto the sample - no glass photomasks/reticles are required.

The system has a continuous, automatic autofocus, using either a pneumatic or optical detection. This enables lithography on non-planar or curved substrates. We also have the high-aspect ratio (variable/long focal length) option installed for very thick (~70µm) photoresists.

Depending on the exposure options and write area, MLA is able to expose a 100mm wafer in about 30min, and achieves minimum features sizes around 0.5µm, with overlay/alignment accuracy better than 200nm.

Lastly, the greyscale lithography is possible, producing repeatable, slanted or tapered structures in photoresist or photo-active dielectrics like SU-8.

Detailed Specifications

  • Wafer size:
  • Wafer / substrate thickness:
  • Exposure optics:
    • Laser #1: 375nm
    • Laser #2: 405nm
  • Focus modes:
  • Alignment:
    • Modes?
    • Accuracy:
    • Repetability
  • Additional manufacturer options:
    • Focus option?
    • Dual lasers?
    • High-resolution option?
  • Uniformity:
  • Write speeds:


Design Tools/Info