Plasma Activation (EVG 810)

From UCSB Nanofab Wiki
Revision as of 10:21, 20 August 2019 by Sawyer l (talk | contribs) (→‎About: updated owner info)
Jump to navigation Jump to search
Plasma Activation (EVG 810)
Tool Type Dry Etch
Location Bay 7
Supervisor Lee Sawyer
Supervisor Phone (805) 893-2123
Supervisor E-Mail
Description Plasma Surface Activation
Manufacturer EVG Group
Dry Etch Recipes
Sign up for this tool


This a capacitively coupled Oxygen plasma activation system used exclusively for the surface activation of clean surfaces prior to wafer bonding. This technique allows bonding temperatures to be lowered and is used as a companion tool to the Karl-Suss SB6 wafer bond tool.

Detailed Specifications

  • Gases used: O2 and N2
  • Sample size: pieces to 6” wafer