YES-150C-Various-Resists

From UCSB Nanofab Wiki
Jump to navigation Jump to search

Pressure drop indicates completion of etch.

Once pressure flattens etching is complete.

There is uncertainty in the exact completion time, somewhere between the peak pressure and the point where it goes flat. Using known PR thicknesses (spun at standard spin speeds - see the datasheets) you can estimate etch rate from these plots.

YES150CResists.jpg