Surface Analysis (KLA/Tencor Surfscan): Difference between revisions
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=About= |
=About= |
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This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. |
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It could scan from 4 to 6 inch wafers. |
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=Documentation= |
=Documentation= |
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Revision as of 17:15, 12 April 2016
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About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It could scan from 4 to 6 inch wafers.