Vacuum Deposition Recipes: Difference between revisions

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| bgcolor="EEFFFF" | {{Rl|Sputtering Recipes|TiO2 deposition (Sputter 2)}}
| bgcolor="EEFFFF" | {{Rl|Sputtering Recipes|TiO2 deposition (Sputter 2)}}
| bgcolor="EEFFFF" | [[Sputtering Recipes|A]]
| bgcolor="EEFFFF" | [[Sputtering Recipes|A]]
| bgcolor="EEFFFF" | [[Sputtering Recipes|A]] {{rl|Sputtering Recipes|Sputter 4 (AJA ATC 2200-V)|TiO2 Deposition (Sputter 4}}
| bgcolor="EEFFFF" | [[Sputtering Recipes|A]] {{rl|Sputtering Recipes|Sputter 4 (AJA ATC 2200-V)|TiO<sub>2</sub> Deposition (Sputter 4}}
| bgcolor="EEFFFF" | <br>
| bgcolor="EEFFFF" | <br>
| bgcolor="EEFFFF" | [[Sputtering_Recipes#TiO2_deposition_.28IBD.29|R]]
| bgcolor="EEFFFF" | [[Sputtering_Recipes#TiO2_deposition_.28IBD.29|R]]

Revision as of 17:59, 14 August 2017

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Vacuum Deposition Recipes

 E-Beam Evaporation Sputtering Thermal Evaporation Plasma Enhanced Chemical
Vapor Deposition (PECVD) 		Atomic Layer Deposition Molecular Vapor Deposition
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 1 (Custom) Sputter 2
(SFI Endeavor) 		Sputter 3
(ATC 2000-F) 		Sputter 4
(ATC 2200-V) 		Sputter 5 (Lesker AXXIS) Ion Beam
Deposition (Veeco Nexus) 		Thermal
Evap 1 		Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790) 		PECVD 2
(Advanced Vacuum) 		Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAL) Molecular Vapor Deposition (Tool)
Ag A
A A

A A








Al A
A A
R1 A R

A A




Al2O3 A A



A A
A




R1
AlN




R1 A A
A




R1
Au A
A A
R1 A R1

A A




B
















CeO2
CeO2 deposition (E-Beam 2)














Co A

A

R









Cr A

A

R


A A




Cu A




A R1 A








Fe A

A

R









Ge A
A A

A A








GeO2 A
Gd A

A












Hf A















HfO2





A A






R1
In










A




Ir A















ITO
ITO deposition (E-Beam 2)



A A
A






MgF2 A A
MgO A
Mo A




R A








Nb A





R








Nd





A








Ni A
A A

R1


A A




NiCr A A
NiFe A A A
Pd A
A A





A A




Pt A
A A

A R1






R1
Ru A

A












Si
A



A A




Amorphous-Si deposition (PECVD#2 R

SiN





R1 A
R

R1 R1 R1

SiO2 A A



R1 A A R

R1 R1 R1 R1
SiOxNy








A

R



Sn










A




SrF2
A














Ta A




R1 A








Ta2O5


A




R






Ti A
A A

A R1 R1








TiN




A
R
A




R1
TiW A




A R1








TiO2
A


R1 A A TiO2 Deposition (Sputter 4
R




R1
V





A A








W A




A R1








Zn









A A




ZnO














R1
Zr A

A

A A








ZrO2














R1
Material E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Sputter 1 (Custom) Sputter 2
(SFI Endeavor) 		Sputter 3
(ATC 2000-F) 		Sputter 4
(ATC 2200-V) 		Sputter 5 (Lesker AXXIS) Ion Beam
Deposition (Veeco Nexus) 		Thermal
Evap 1 		Thermal Evap 2 (Solder) PECVD 1
(PlasmaTherm 790) 		PECVD 2
(Advanced Vacuum) 		Unaxis VLR ICP-PECVD Atomic Layer Deposition (Oxford FlexAl) Molecular Vapor Deposition (Tool)
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