Dry Etching Recipes: Difference between revisions

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{{Recipe Table Explanation}}
{{Recipe Table Explanation}}
{| border="1" class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
{| class="wikitable" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
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! width="725" height="45" colspan="16" | <div style="font-size: 150%;">Dry Etching Recipes</div>
! colspan="16" width="725" height="45" | <div style="font-size: 150%;">Dry Etching Recipes</div>
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! width="300" bgcolor="#D0E7FF" align="center" height="35" colspan="4" | '''[[RIE Etching Recipes|RIE Etching]]'''
! colspan="4" width="300" bgcolor="#D0E7FF" align="center" height="35" | '''[[RIE Etching Recipes|RIE Etching]]'''
! width="300" bgcolor="#D0E7FF" align="center" colspan="4" | '''[[ICP Etching Recipes|ICP Etching]]'''
! colspan="4" width="300" bgcolor="#D0E7FF" align="center" | '''[[ICP Etching Recipes|ICP Etching]]'''
! bgcolor="#D0E7FF" align="center" colspan="4"|'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
! colspan="4" bgcolor="#D0E7FF" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
! bgcolor="#D0E7FF" align="center" colspan="3" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
! colspan="3" bgcolor="#D0E7FF" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
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! width="65" bgcolor="#D0E7FF" align="center" | '''Material'''
! width="65" bgcolor="#D0E7FF" align="center" | '''Material'''
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| width="85" bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
| width="85" bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
| width="85" bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
| width="85" bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
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! bgcolor="#D0E7FF" align="center" | Al
! bgcolor="#D0E7FF" align="center" | Ag
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! bgcolor="#D0E7FF" align="center" | HfO<sub>2</sub>
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Revision as of 20:52, 22 September 2017

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 1
(Retired) 		RIE 2
(MRC) 		RIE 3
(MRC) 		RIE 5
(PlasmaTherm) 		Si Deep RIE
(PTI/Bosch) 		ICP Etch 1
(Panasonic 1) 		ICP Etch 2
(Panasonic 2) 		ICP-Etch
(Unaxis VLR) 		Ashers
(Technics PEII) 		Plasma Clean
(Gasonics 2000) 		UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
Ag
Al A R1 R1
Au R1
Cr A R1 A
Cu
Ge
Ni R1
Pt R1
Ti R1 A
Ru
Mo
Ta
W-TiW R1 A
Al2O3
HfO2
ITO R1
SiO2 SiO2 Etching (RIE 3) R1 R1 R1
SiN SiNx Etching (RIE 3) R1 R1
SiOxNy
Ta2O5
TiO2
TiN
ZnO2
ZrO2
GaAs R1 R1 R1 GaAs-AlGaAs Etch (Unaxis VLR)
AlGaAs R1 R1 GaAs-AlGaAs Etch (Unaxis VLR)
InGaAlAs InP-InGaAsP-InGaAlAs Etching (RIE 2) InP-InGaAs-InAlAs Etch (Unaxis VLR)
InGaAsP InP-InGaAsP-InGaAlAs Etching (RIE 2) InP-InGaAs-InAlAs Etch (Unaxis VLR)
InP InP-InGaAsP-InGaAlAs Etching (RIE 2) InP-InGaAs-InAlAs Etch (Unaxis VLR)
GaN GaN Etch (RIE 5) R1 R1
AlGaN R1
AlN R1
GaSb GaSb Etch Unaxis VLR)
CdZnTe R1
ZnS R1
ZnSe R1
Si R1 R1
SiC R1 A
Sapphire R1 A
Material RIE 1
(Retired) 		RIE 2
(MRC) 		RIE 3
(MRC) 		RIE 5
(PlasmaTherm) 		Si Deep RIE
(PlasmaTherm/Bosch Etch) 		ICP Etch 1
(Panasonic E626I) 		ICP Etch 2
(Panasonic E640) 		ICP-Etch
(Unaxis VLR) 		Ashers
(Technics PEII) 		Plasma Clean
(Gasonics 2000) 		UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Dry_Etching_Recipes&oldid=154444"