Dry Etching Recipes: Difference between revisions

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m (removed spurious column |- text, alphabetizing.)
(Added Ta2O5 etching, described in paper by Blumenthal Group.)
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! bgcolor="#D0E7FF" align="center" | Al<sub>2</sub>O<sub>3 (Sapphire)</sub>
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| {{rl|ICP Etching Recipes|Sapphire Etch(Panasonic 1)}}
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! bgcolor="#D0E7FF" align="center" | Sapphire (Al<sub>2</sub>O<sub>3</sub>)
! bgcolor="#D0E7FF" align="center" | SiC
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! bgcolor="#D0E7FF" align="center" | SiC
! bgcolor="#D0E7FF" align="center" | SiN
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|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiN<sub>x</sub> Etching (RIE 3)}}
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| {{rl|Other Dry Etching Recipes|Other Dry Etch (Vapor HF Etcher)}}
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! bgcolor="#D0E7FF" align="center" | SiN
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|[https://www.osapublishing.org/optica/abstract.cfm?uri=optica-4-5-532 A]
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! bgcolor="#D0E7FF" align="center" | TiO<sub>2</sub>
! bgcolor="#D0E7FF" align="center" | TiN
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! bgcolor="#D0E7FF" align="center" | TiN
! bgcolor="#D0E7FF" align="center" | TiO<sub>2</sub>
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! bgcolor="#D0E7FF" align="center" | ZrO<sub>2</sub>
! bgcolor="#D0E7FF" align="center" | ZnS
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! bgcolor="#D0E7FF" align="center" | ZnS
! bgcolor="#D0E7FF" align="center" | ZnSe
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! bgcolor="#D0E7FF" align="center" | ZnSe
! bgcolor="#D0E7FF" align="center" | ZrO<sub>2</sub>
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! bgcolor="#D0E7FF" align="center" | '''Material'''
! bgcolor="#D0E7FF" align="center" | '''Material'''

Revision as of 21:14, 22 September 2017

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 1
(Retired)
RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
Si Deep RIE
(PTI/Bosch)
ICP Etch 1
(Panasonic 1)
ICP Etch 2
(Panasonic 2)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)
Ag
Al A R1 R1
Au R1
Cr A R1 A
Cu
Ge
Mo
Ni R1
Pt R1
Ru
Ta
Ti R1 A
Al2O3
Al2O3 (Sapphire) R1 A
AlGaAs R1 R1 GaAs-AlGaAs Etch (Unaxis VLR)
AlGaN R1
AlN R1
CdZnTe R1
GaAs R1 R1 R1 GaAs-AlGaAs Etch (Unaxis VLR)
GaN GaN Etch (RIE 5) R1 R1
GaSb GaSb Etch Unaxis VLR)
HfO2
InGaAlAs InP-InGaAsP-InGaAlAs Etching (RIE 2) InP-InGaAs-InAlAs Etch (Unaxis VLR)
InGaAsP InP-InGaAsP-InGaAlAs Etching (RIE 2) InP-InGaAs-InAlAs Etch (Unaxis VLR)
InP InP-InGaAsP-InGaAlAs Etching (RIE 2) InP-InGaAs-InAlAs Etch (Unaxis VLR)
ITO R1
Si R1 R1
SiC R1 A
SiN SiNx Etching (RIE 3) R1 R1
SiO2 SiO2 Etching (RIE 3) R1 R1 R1
SiOxNy
Ta2O5 A
TiN
TiO2
W-TiW R1 A
ZnO2
ZnS R1
ZnSe R1
ZrO2
Material RIE 1
(Retired)
RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
Si Deep RIE
(PlasmaTherm/Bosch Etch)
ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)