Dry Etching Recipes: Difference between revisions

From UCSB Nanofab Wiki
Jump to navigation Jump to search
m (Reverted edits by John d (talk) to last revision by Thibeault)
(added space to ICP1/2 recipe links, hopefully fixes targeted links)
Line 53: Line 53:
|
|
|
|
| {{rl|ICP Etching Recipes|Al Etch(Panasonic 1)}}
| {{rl|ICP Etching Recipes|Al Etch (Panasonic 1)}}
| {{rl|ICP Etching Recipes|Al Etch(Panasonic 2)}}
| {{rl|ICP Etching Recipes|Al Etch (Panasonic 2)}}
|
|
|
|
Line 89: Line 89:
|
|
|
|
| {{rl|ICP Etching Recipes|Cr Etch(Panasonic 1)}}
| {{rl|ICP Etching Recipes|Cr Etch (Panasonic 1)}}
| A
| A
|
|
Line 251: Line 251:
|
|
|
|
| {{rl|ICP Etching Recipes|Ti Etch(Panasonic 1)}}
| {{rl|ICP Etching Recipes|Ti Etch (Panasonic 1)}}
| A
| A
|
|
Line 287: Line 287:
|
|
|
|
| {{rl|ICP Etching Recipes|Sapphire Etch(Panasonic 1)}}
| {{rl|ICP Etching Recipes|Sapphire Etch (Panasonic 1)}}
| A
| A
|
|
Line 521: Line 521:
|
|
|
|
| {{rl|ICP Etching Recipes|SiC Etch(Panasonic 1)}}
| {{rl|ICP Etching Recipes|SiC Etch (Panasonic 1)}}
| A
| A
|
|
Line 539: Line 539:
|
|
|
|
| {{rl|ICP Etching Recipes|SINxEtch(Panasonic 1)}}
| {{rl|ICP Etching Recipes|SiNx Etching (Panasonic 1)}}
| {{rl|ICP Etching Recipes|SINxEtch(Panasonic 2)}}
| {{rl|ICP Etching Recipes|SiNx Etching (Panasonic 2)}}
|
|
|
|
Line 557: Line 557:
|
|
|
|
| {{rl|ICP Etching Recipes|SIO2Etch(Panasonic 1)}}
| {{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 1)}}
| {{rl|ICP Etching Recipes|SIO2Etch(Panasonic 2)}}
| {{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 2)}}
|
|
|
|
Line 647: Line 647:
|
|
|
|
| {{rl|ICP Etching Recipes|W-TiW Etch(Panasonic 1)}}
| {{rl|ICP Etching Recipes|W-TiW Etch (Panasonic 1)}}
| A
| A
|
|

Revision as of 17:42, 8 January 2018

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 1
(Retired) 		RIE 2
(MRC) 		RIE 3
(MRC) 		RIE 5
(PlasmaTherm) 		DSEIII
(PlasmaTherm) 		Si Deep RIE
(PTI/Bosch) 		ICP Etch 1
(Panasonic 1) 		ICP Etch 2
(Panasonic 2) 		ICP-Etch
(Unaxis VLR) 		Ashers
(Technics PEII) 		Plasma Clean
(Gasonics 2000) 		UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
Ag
Al A R1 R1
Au R1
Cr A R1 A
Cu
Ge
Mo
Ni R1
Pt R1
Ru
Si R1 R1
Ta
Ti R1 A
Al2O3
Al2O3 (Sapphire) R1 A
AlGaAs R1 R1 GaAs-AlGaAs Etch (Unaxis VLR)
AlGaN R1
AlN R1
CdZnTe R1
GaAs R1 R1 R1 GaAs-AlGaAs Etch (Unaxis VLR)
GaN GaN Etch (RIE 5) R1 R1
GaSb A GaSb Etch Unaxis VLR)
HfO2
InGaAlAs InP-InGaAsP-InGaAlAs Etching (RIE 2) InP-InGaAs-InAlAs Etch (Unaxis VLR)
InGaAsP InP-InGaAsP-InGaAlAs Etching (RIE 2) InP-InGaAs-InAlAs Etch (Unaxis VLR)
InP InP-InGaAsP-InGaAlAs Etching (RIE 2) A A InP-InGaAs-InAlAs Etch (Unaxis VLR)
ITO R1
SiC R1 A
SiN SiNx Etching (RIE 3) R1 R1
SiO2 SiO2 Etching (RIE 3) R1 R1 R1
SiOxNy
Ta2O5 A
TiN
TiO2
W-TiW R1 A
ZnO2
ZnS R1
ZnSe R1
ZrO2
Material RIE 1
(Retired) 		RIE 2
(MRC) 		RIE 3
(MRC) 		RIE 5
(PlasmaTherm) 		DSEIII
(PlasmaTherm) 		Si Deep RIE
(PlasmaTherm/Bosch Etch) 		ICP Etch 1
(Panasonic E626I) 		ICP Etch 2
(Panasonic E640) 		ICP-Etch
(Unaxis VLR) 		Ashers
(Technics PEII) 		Plasma Clean
(Gasonics 2000) 		UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Dry_Etching_Recipes&oldid=154705"