Ion Beam Deposition (Veeco NEXUS): Difference between revisions
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*Xenon target bombardment |
*Xenon target bombardment |
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*Nitrogen and/or Oxygen deposition assist source for metal oxides/nitrides |
*Nitrogen and/or Oxygen deposition assist source for metal oxides/nitrides |
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*Targets: Ta, Si, Al, Ti, ITO |
*Available Targets: Ta, Si, Al, Ti, ITO (up to 4 installed at a time) |
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*Pieces up to 6” wafers accepted |
*Pieces up to 6” wafers accepted |
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*Full programmable control through GUI for multi-layer optical coatings |
*Full programmable control through GUI for multi-layer optical coatings |
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*Standard Recipes: Ta<sub>2</sub>O<sub>5</sub> (1.33 A/s rate), SiO<sub>2</sub> (0.85A/s), Si<sub>3</sub>N<sub>4</sub>, TiO<sub>2</sub>. |
*Standard Recipes: Ta<sub>2</sub>O<sub>5</sub> (1.33 A/s rate), SiO<sub>2</sub> (0.85A/s), Si<sub>3</sub>N<sub>4</sub>, TiO<sub>2</sub>, Al<sub>2</sub>O<sub>3</sub>. |
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** Custom recipes: |
** Custom recipes: SiO<sub>x</sub>N<sub>y</sub>, AlN, TaN |
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*Base Pressure ≤ 3e-8 Torr |
*Base Pressure ≤ 3e-8 Torr |
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*High quality, High Reflectivity DBR (>99.5%) mirrors demonstrated in blue wavelengths |
*High quality, High Reflectivity DBR (>99.5%) mirrors demonstrated in blue wavelengths |
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Revision as of 21:03, 16 March 2018
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About
This tool is designed for high quality, precise, reproducible deposition of dielectric films for optical quality films. Metallic material is ion bombarded from a target material and a reactive ion beam of oxygen and/or nitrogen is aimed at the surface, creating a metal-oxide or nitride on the sample. The system is fully computer controlled to facilitate multi-layer stack recipes for high reflectivity or low reflectivity coatings. The system is load locked and can handle wafers up to 6” in diameter as well as small pieces. Sample rotation and angling is used to facilitate material quality and allows for sidewall coverage on non-planar surfaces. Uniformity is better than 1.5% over 6" wafers and reproducibility is expected to be within one percent (with pre-dep calibration). The high-energy sputter deposition produces denser films than other techniques, improving optical damage threshold (and thus coating lifetime). This also causes the refractive indices to be slightly higher than comparable stoichiometric films deposited by other techniques.
Four metallic targets can be installed (producing Oxides & Nitrides of each). Ta & Si are always available, the others are rotated out as users need them.
The most common films for High-/Anti-Reflection (HR/AR) coatings are SiO2 & Ta2O5, both of which are extremely stable w/r/to refractive index. Users typically calibrate their dep. rates prior to critical deps. & multi-layer coatings.
Detailed Specifications
- Xenon target bombardment
- Nitrogen and/or Oxygen deposition assist source for metal oxides/nitrides
- Available Targets: Ta, Si, Al, Ti, ITO (up to 4 installed at a time)
- Pieces up to 6” wafers accepted
- Full programmable control through GUI for multi-layer optical coatings
- Standard Recipes: Ta2O5 (1.33 A/s rate), SiO2 (0.85A/s), Si3N4, TiO2, Al2O3.
- Custom recipes: SiOxNy, AlN, TaN
- Base Pressure ≤ 3e-8 Torr
- High quality, High Reflectivity DBR (>99.5%) mirrors demonstrated in blue wavelengths
- Wide-band Anti-Reflection coatings demonstrated in near-IR (~1550nm)