Dry Etching Recipes: Difference between revisions

Revision as of 22:00, 28 August 2018

R = Recipe is available. Clicking this link will take you to the recipe.

Dry Etching Recipes
	RIE Etching				ICP Etching					Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	SLR Fluorine ICP (PlasmaTherm)	ICP Etch 1 (Panasonic 1)	ICP Etch 2 (Panasonic 2)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Ag
Al				A			R1	R1
Au																R1
Cr				A			R1	A
Cu
Ge														A
Mo
Ni																R1
Pt																R1
Ru
Si					R1	A								R1
Ta
Ti							R1	A
Al₂O₃								R
Al₂O_{3 (Sapphire)}							R1	A
AlGaAs				R1			R1		GaAs-AlGaAs Etch (Unaxis VLR)
AlGaN									R1
AlN									R1
CdZnTe		R1
GaAs				R1			R1	R1	GaAs-AlGaAs Etch (Unaxis VLR)
GaN				R1			R1		R1
GaSb								A	GaSb Etch Unaxis VLR)
HfO₂
InGaAlAs		InP-InGaAsP-InGaAlAs Etching (RIE 2)							InP-InGaAs-InAlAs Etch (Unaxis VLR)
InGaAsP		InP-InGaAsP-InGaAlAs Etching (RIE 2)							InP-InGaAs-InAlAs Etch (Unaxis VLR)
InP		InP-InGaAsP-InGaAlAs Etching (RIE 2)					A	A	InP-InGaAs-InAlAs Etch (Unaxis VLR)
ITO		R1
Photoresist & ARC			A	A			A	R		A	A
SiC							R1	A
SiN			SiN_x Etching (RIE 3)				R1	R1		A
SiO₂			SiO₂ Etching (RIE 3)			A	R1	R1							R1
SiOxNy							A	A
Ta₂O₅								A
TiN
TiO₂
W-TiW							R1	A
ZnO₂
ZnS		R1
ZnSe		R1
ZrO₂
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	Si Deep RIE (PlasmaTherm/Bosch Etch)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)

@@ Line 16: / Line 16: @@
 | width="100" bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
 | width="100" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
-| width="100" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PTI/Bosch)]]
+| width="100" bgcolor="#daf1ff" | [[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|SLR Fluorine ICP (PlasmaTherm)]]
 | width="120" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]
 | width="120" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]]
@@ Line 214: / Line 214: @@
 |
 | {{rl|ICP Etching Recipes|DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)}}
+| A
-| {{rl|ICP Etching Recipes|Si Etch (PlasmaTherm/Bosch Etch)}}
 |
 |
@@ Line 575: / Line 575: @@
 |
 |
-|
+| A
 | {{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 1)}}
 | {{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 2)}}