Dicing Saw (ADT): Difference between revisions
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= About = |
== About == |
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The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 6” diameter wafers. |
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 6” diameter wafers. |
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== Recipes == |
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* Packaging Recipes > [https://www.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes (ADT 7100)] |
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Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting. |
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Revision as of 15:58, 16 October 2018
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About
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 6” diameter wafers.
Recipes
- Packaging Recipes > Dicing Saw Recipes (ADT 7100)
Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting.