Packaging Recipes

Dicing Saw Recipes (ADT 7100)

Cutting Parameters

Material	Blade Type	Spindle Speed	Cut Speed

Blade Diam	Flange Diam.	Blade Exposure

Mounting/Unmounting Samples

The UV-Release Tape dispenser is most-often used for mounting sample for dicing.

The Tape Model installed is XYZXYZ. Data Sheet Here.

• Procedure for mounting sample on UV-Release Tape
• Full Release: 60 sec exposure
• Partial Release for Shipping: 9 sec exposure

Surface Protection

Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).

1. Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe. Contact Alignment PR Recipes Stepper PR Recipes

1. Perform your dicing
2. Strip the PR in Acetone and ISO & N2 dry

Wafer Bonder (Logitech WBS7)

This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.

Wax Mounting Procedure, with Spin-On Crystalbond

Draft only - in progress.  -- Demis 2018-10-16

• Mix a fresh squirt bottle of CrystalBond diluted with Acetone (see Don Freeborn for method).
  • XYZ grams of crystalbond, mixed into
  • XYZ mL of Acetone, in dedicated squirt bottle
  • Shake/stir to completely dissolve the wax
• Place 4-inch silicon carrier wafer on POLOS spinner in solvent bench, with non-vacuum 4-inch chuck installed.
• Set up POLOS recipe
  • Spin at XYZ rpm for XYZ sec.
• Squirt wax solution onto wafer
• I/O to spin.
• Place carrier wafer on Logitech bonder surface
• Place sample to be bonded on top
• Place 110mm chemical filter paper on top
• Close lid, secure lid clamp
• Run recipe:
  • XYZ °C
  • XYZ seconds
  • Vacuum etc.?