Plasma Activation (EVG 810)

Plasma Activation (EVG 810) Tool Type Dry Etch Location Bay 7 Supervisor Lee Sawyer Supervisor Phone (805) 893-2123 Supervisor E-Mail lee_sawyer@ucsb.edu Description Plasma Surface Activation Manufacturer EVG Group Dry Etch Recipes Sign up for this tool

About

This a capacitively coupled Oxygen plasma activation system used exclusively for the surface activation of clean surfaces prior to wafer bonding. This technique allows bonding temperatures to be lowered and is used as a companion tool to the Karl-Suss SB6 wafer bond tool.

Detailed Specifications

• Gases used: O₂ and N₂
• Sample size: pieces to 6” wafer
• Max power: 200W
• Recipes characterized for substrate thicknesses between 250um and 750um. Thicknesses outside of this range need to have parameters optimized to minimize reflective power.

Documentation

• Plasma Activation Standard Operating Procedure

Recipes

Please see the Oxygen Plasma Recipe page for standard EVG recipes.