PECVD1 Wafer Coating Process: Difference between revisions

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-=== PECVD#1 deposition - 300nm SiN film @250°C ===
-The wafers are ordered from SVM. These are low particle count 4" Si wafer where particle count is very low <100.
-a)Log in to PECVD #1 (Staff account)
-b)Edit standard recipes (for seasoning, deposition, and cleaning). You can '''ONLY''' change the time in recipes.
-* •Seasoning recipe name:
-* •Deposition recipe name:
-* •Cleaning recipe name:
-c)Load the recipe for seasoning, and run it. The goal of this step is to coat chamber walls and prepare it for deposition.
-d)Vent the chamber and load 4"Si wafer (place in in the center of platen). You can place small pieces around, to protect wafer from moving
-e)Pump down and load the recipe for deposition.
-f) Edit the recipe for deposition, change the time ONLY.
-g) Run deposition
-h) Wait for deposition to be finished. Unload the wafer
-i) Wipe sidewall first with water then with IPA.
-j) Load recipe for cleaning. Edit the recipe and enter required time for cleaning.

Revision as of 00:37, 31 March 2020