Surface Analysis (KLA/Tencor Surfscan): Difference between revisions
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(→Documentation: wafer scanning process traveler) |
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*[//wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual] |
*[//wiki.nanotech.ucsb.edu/w/images/9/96/Surfscan-Operation-Manual.pdf Operations Manual] |
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**''For detailed measurement info, it is highly recommended that you read the manual.'' |
**''For detailed measurement info, it is highly recommended that you read the manual.'' |
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*[//wiki.nanotech.ucsb.edu/w/images/2/27/Surfscan-Surfscan_6200_info.pdf Surfscan Info] |
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*[[Wafer scanning process traveler]] |
*[[Wafer scanning process traveler]] |
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* |
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=== Screenshots === |
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[[File:UCSBTEST.png|left|thumb|'''UCSBTEST2''' for big size particles '''(1.6-28.0)um''']][[File:UCSBTEST2 for small particles.png|left|thumb|'''UCSBTEST2''' for small size particles '''(0.16-1.6)um''']] |
Revision as of 00:17, 1 April 2020
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About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.
Documentation
- Standard Operating Procedure
- Operations Manual
- For detailed measurement info, it is highly recommended that you read the manual.
- Wafer scanning process traveler