Surface Analysis (KLA/Tencor Surfscan): Difference between revisions
Jump to navigation
Jump to search
Line 19: | Line 19: | ||
*[[Wafer scanning process traveler]] |
*[[Wafer scanning process traveler]] |
||
*[[Glossary]] |
*[[Glossary]] |
||
*Errors |
*[[Errors]] |
Revision as of 22:08, 7 April 2020
|
About
This system uses a laser-based scattering method to count size and distribution of particles (or other scattering defects) on a flat wafer surface. It can scan wafers in size from 4 to 8 inches.
Documentation
- Standard Operating Procedure
- Operations Manual
- For detailed measurement info, it is highly recommended that you read the manual.
- Wafer scanning process traveler
- Glossary
- Errors