Bill Millerski: Difference between revisions

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{{staff|{{PAGENAME}}
{{staff|{{PAGENAME}}
|position = Equipment Engineer
|position = Senior Equipment Engineer
|room = 1109F
|room = 1109F
|phone = (805) 893-2655
|phone = (805) 839-2655
|cell =
|email = wmillerski@ucsb.edu
|email = wmillerski@ucsb.edu
}}
}}
=About=
= About =
.


.
=Current Work=

.


=Tools=
=Tools=
Bill Millerski is in charge of the following tools:
{{PAGENAME}} is the supervisor for the following tools.
{{tool|{{PAGENAME}}
|picture=FlexAL.jpg
{{tool|{{PAGENAME}}
|type = Vacuum Deposition
|super= Bill Millerski
|phone=(805)839-2655
|location=Bay 2
|email=wmillerski@ucsb.edu
|description = Oxford FlexAL Atomic Layer Deposition
|manufacturer = [http://www.oxford-instruments.com/businesses/plasma-technology/Pages/plasma-technology.aspx Oxford Instruments Plasma Technologies]
|materials =
|toolid=6
}}


{|
{|
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* [[Stepper 2 (AutoStep 200)]]
* [[Stepper 2 (AutoStep 200)]]
* [[Ion Beam Deposition (Veeco NEXUS)]]
* [[Ion Beam Deposition (Veeco NEXUS)]]
* [[RIE 5 (PlasmaTherm)]]
* [[Rapid Thermal Processor (AET RX6)]]
* [[Rapid Thermal Processor (SSI Solaris 150)]]
* [[Step Profilometer (KLA Tencor P-7)]]
* [[Chemical-Mechanical Polisher (Logitech)]]
||
* [[XeF2 Etch (Xetch)]]
* [[Mechanical Polisher (Allied)]]
* [[Tube Furnace Wafer Bonding (Thermco)]]
* [[E-Beam 1 (Sharon)]]
* [[Resistivity Mapper (CDE RESMAP)]]
* [[Optical Film Thickness (Nanometric)]]
* [[Vapor HF Etch]]
* [[Wafer Bonder (Logitech WBS7)]]
|}

Latest revision as of 15:28, 28 October 2021