Chemical-Mechanical Polisher (Logitech): Difference between revisions
Jump to navigation
Jump to search
No edit summary |
(link to Logitech Bonder) |
||
| Line 11: | Line 11: | ||
|toolid=50 |
|toolid=50 |
||
}} |
}} |
||
= |
=About= |
||
The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system. |
The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system. |
||
Several slurries and pads are available to provide a range of polishing options depending on the material being processed. Pieces can also be handled on the system by wax-mounting with the [[Wafer Bonder (Logitech WBS7)|Logitech Bonder]]. |
|||
Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications. |
|||
Revision as of 00:06, 4 March 2022
| |||||||||||||||||||||
About
The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system.
Several slurries and pads are available to provide a range of polishing options depending on the material being processed. Pieces can also be handled on the system by wax-mounting with the Logitech Bonder.
Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications.