Dicing Saw (ADT): Difference between revisions
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==Detailed Specifications== |
==Detailed Specifications== |
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*Maximum Wafer Size: 8" |
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*Parts mounted to UV-release tape for cutting |
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*Automated cut maps at multiple angles (0° and 90° typical) |
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*~few micron alignment to on-wafer features. |
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*Thermocarbon Resnoid dicing blades provided by staff |
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==Operating Procedures== |
==Operating Procedures== |
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*[https://wiki.nanotech.ucsb.edu/w/images/ |
*[https://wiki.nanotech.ucsb.edu/w/images/1/11/ADT_SOP_Rev_E.pdf ADT Dicing Saw Standard Operating Procedure] |
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*[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]] |
*[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]] |
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Revision as of 20:48, 21 March 2022
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About
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.
Contact the tool supervisor for blades and dicing frames for your group.
Detailed Specifications
- Maximum Wafer Size: 8"
- Parts mounted to UV-release tape for cutting
- Automated cut maps at multiple angles (0° and 90° typical)
- ~few micron alignment to on-wafer features.
- Thermocarbon Resnoid dicing blades provided by staff
Operating Procedures
Recipes
- Recipes > Packaging > Dicing Saw Recipes (ADT 7100)
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.