Chemical-Mechanical Polisher (Logitech)

Chemical-Mechanical Polisher (Logitech) Location Bay 5 Tool Type Dry Etch Manufacturer Logitech Description ORBIS Chemical Mechanical Polisher Primary Supervisor Bill Millerski (805) 893-2655 wmillerski@ucsb.edu Secondary Supervisor Don Freeborn Recipes Dry Etch Recipes SignupMonkey: Sign up for this tool

About

The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system.

Several slurries and pads are available to provide a range of polishing options depending on the material being processed. Pieces can also be handled on the system by wax-mounting with the Logitech Bonder.

Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications.

Instructions

https://wiki.nanotech.ucsb.edu/w/images/c/c0/CMP.pdf