Wafer Cleaver (PELCO Flip-Scribe): Difference between revisions
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|type = Packaging |
|type = Packaging |
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|super= Brian Thibeault |
|super= Brian Thibeault |
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|location=ESB |
|location=ESB 1111 |
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|description = Manual Cleaving |
|description = Manual Cleaving |
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|model = [https://www.tedpella.com/Material-Sciences_html/PELCO-FlipScribe.aspx PELCO Flip-Scribe] |
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|model = LatticeAx |
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|manufacturer = |
|manufacturer = [https://www.tedpella.com TedPella Inc.] |
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|materials = |
|materials = |
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|toolid= |
|toolid= |
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}} |
}} |
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==About== |
==About== |
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The |
The Flip-Scribe is a manual scribe+break cleaving system, with a diamond tip that scribes along the underside of the part/wafer. The user manually drags the part across the diamond scribe, using the guides and stops to push the part in a controlled, straight line. |
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Manual breaking tools are provided to perform the break after scribing. |
Manual breaking tools are provided to perform the break after scribing. |
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Can scribe/break ~350µm thick sapphire wafers. Thicker/more difficult to cleave parts should be thinned down on the [[Mechanical Polisher (Allied)|Allied Polisher]] before cleaving. |
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==Detailed Specifications== |
==Detailed Specifications== |
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* |
*Wafer/Parts Sizes: 4" down to ~10mm |
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*Digital microscope w/ laptop for finer alignment |
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*~100µm alignment accuracy |
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==Operating Procedures== |
==Operating Procedures== |
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* [[LatticeAx SOP]] - To be added |
*Flipscribe [[LatticeAx SOP|SOP]] - To be added |
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==Recipes== |
==Recipes== |
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*Recipes > Packaging > '''[[Packaging Recipes#LatticeAx|To Be Added]]''' |
*Recipes > Packaging > '''[[Packaging Recipes#LatticeAx|''To Be Added'']]''' |
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Be sure to also see the recipes for protecting your sample from dicing dust on the [[Packaging Recipes]] page. |
Be sure to also see the recipes for protecting your sample from dicing dust on the [[Packaging Recipes|'''Packaging Recipes''']] page. |
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Latest revision as of 14:57, 13 December 2022
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About
The Flip-Scribe is a manual scribe+break cleaving system, with a diamond tip that scribes along the underside of the part/wafer. The user manually drags the part across the diamond scribe, using the guides and stops to push the part in a controlled, straight line. Manual breaking tools are provided to perform the break after scribing.
Can scribe/break ~350µm thick sapphire wafers. Thicker/more difficult to cleave parts should be thinned down on the Allied Polisher before cleaving.
Detailed Specifications
- Wafer/Parts Sizes: 4" down to ~10mm
- Digital microscope w/ laptop for finer alignment
- ~100µm alignment accuracy
Operating Procedures
- Flipscribe SOP - To be added
Recipes
- Recipes > Packaging > To Be Added
Be sure to also see the recipes for protecting your sample from dicing dust on the Packaging Recipes page.