Wafer Cleaver (PELCO Flip-Scribe): Difference between revisions
Jump to navigation
Jump to search
(LatticeAx --> Flip-Scribe) |
(changed room --> ESB 1111) |
||
| (2 intermediate revisions by 2 users not shown) | |||
| Line 3: | Line 3: | ||
|type = Packaging |
|type = Packaging |
||
|super= Brian Thibeault |
|super= Brian Thibeault |
||
|location=ESB |
|location=ESB 1111 |
||
|description = Manual Cleaving |
|description = Manual Cleaving |
||
|model = [https://www.tedpella.com/Material-Sciences_html/PELCO-FlipScribe.aspx PELCO Flip-Scribe] |
|model = [https://www.tedpella.com/Material-Sciences_html/PELCO-FlipScribe.aspx PELCO Flip-Scribe] |
||
| Line 24: | Line 24: | ||
==Operating Procedures== |
==Operating Procedures== |
||
*[[LatticeAx SOP]] - To be added |
*Flipscribe [[LatticeAx SOP|SOP]] - To be added |
||
Latest revision as of 14:57, 13 December 2022
|
About
The Flip-Scribe is a manual scribe+break cleaving system, with a diamond tip that scribes along the underside of the part/wafer. The user manually drags the part across the diamond scribe, using the guides and stops to push the part in a controlled, straight line. Manual breaking tools are provided to perform the break after scribing.
Can scribe/break ~350µm thick sapphire wafers. Thicker/more difficult to cleave parts should be thinned down on the Allied Polisher before cleaving.
Detailed Specifications
- Wafer/Parts Sizes: 4" down to ~10mm
- Digital microscope w/ laptop for finer alignment
- ~100µm alignment accuracy
Operating Procedures
- Flipscribe SOP - To be added
Recipes
- Recipes > Packaging > To Be Added
Be sure to also see the recipes for protecting your sample from dicing dust on the Packaging Recipes page.