Automated Wafer Cleaver (Loomis LSD-155LT): Difference between revisions

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Automated Wafer Cleaver (Loomis LSD-155LT)
File:LoomisLSD155lt.jpg
Location Backend Lab: ESB 1111
Tool Type Packaging
Manufacturer Loomis Industries Inc.
Model LSD-155LT
Description Loomis Automated Wafer Cleaver
Primary Supervisor Aidan Hopkins
(805) 893-2343
hopkins@ece.ucsb.edu
Materials III-V's, thin Silicon
Recipes


About

TBD: Insert info general here.

Detailed Specifications

  • Maximum Wafer Size:
  • Parts mounted to UV-release tape for cutting
  • Automated cut maps at multiple angles (0° and 90° typical)
  • ~few micron alignment to on-wafer features.
  • TBD

Operating Procedures

Recipes

  • Recipes > Packaging > Wafer Cleaver Recipes (LSD-155LT)
  • Wafer thinning is critical, see the Wafer Lapping (Allied XYZ) tool as well.
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