Mechanical Polisher (Allied): Difference between revisions
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{{tool2|{{PAGENAME}} |
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|picture=AlliedPolisher10-1110.jpg |
|picture=AlliedPolisher10-1110.jpg |
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|type = Wet Processing |
|type = Wet Processing |
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|super= |
|super= Bill Millerski |
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|location=ESB |
|location=ESB Rm. 1111 |
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|description = Mechanical Polisher |
|description = Mechanical Polisher |
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|manufacturer = Allied High Tech Products Inc. |
|manufacturer = Allied High Tech Products Inc. |
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|toolid=70 |
|toolid=70 |
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=About= |
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The Allied Polisher allows for bulk thinning of substrates, and fine polishing of optical waveguide facets. Various materials are typically lapped/polished, such as Silicon GaAs, InP. |
The Allied Polisher allows for bulk thinning of substrates, and fine polishing of optical waveguide facets. Various materials are typically lapped/polished, such as Silicon GaAs, InP. |
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==Detailed Specs== |
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== Operating Procedures == |
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==Operating Procedures== |
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* ''To Be Added'' |
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*[https://wiki.nanotech.ucsb.edu/w/images/f/f2/Mechanical_Polisher_SOP_Rev_A.pdf Mechanical Polisher SOP] |
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==Recipes== |
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Latest revision as of 16:06, 15 May 2023
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About
The Allied Polisher allows for bulk thinning of substrates, and fine polishing of optical waveguide facets. Various materials are typically lapped/polished, such as Silicon GaAs, InP.
Detailed Specs
- Max. Substrate Size
- Lapping Films available:
- 10µm AlOx
- 5µm AlOx
- 2µm AlOx
- 1µm AlOx
- 0.5 AlOx
Operating Procedures
Recipes
- To Be Added