Mechanical Polisher (Allied): Difference between revisions

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= About =
=About=
The Allied Polisher allows for bulk thinning of substrates, and fine polishing of optical waveguide facets. Various materials are typically lapped/polished, such as Silicon GaAs, InP.
The Allied Polisher allows for bulk thinning of substrates, and fine polishing of optical waveguide facets. Various materials are typically lapped/polished, such as Silicon GaAs, InP.


== Detailed Specs ==
==Detailed Specs==
* Max. Substrate Size
* Lapping Films available:
** 10µm AlOx
** 5µm AlOx
** 2µm AlOx
** 1µm AlOx
** 0.5 AlOx


*Max. Substrate Size
== Operating Procedures ==
*Lapping Films available:
* ''To Be Added''
**10µm AlOx
**5µm AlOx
**2µm AlOx
**1µm AlOx
**0.5 AlOx


== Recipes ==
==Operating Procedures==

* ''To Be Added''
*[https://wiki.nanotech.ucsb.edu/w/images/f/f2/Mechanical_Polisher_SOP_Rev_A.pdf Mechanical Polisher SOP]

==Recipes==

*''To Be Added''

Latest revision as of 16:06, 15 May 2023

Mechanical Polisher (Allied)
AlliedPolisher10-1110.jpg
Location ESB Rm. 1111
Tool Type Wet Processing
Manufacturer Allied High Tech Products Inc.
Model 10-1110
Description Mechanical Polisher

Primary Supervisor Bill Millerski
(805) 893-2655
wmillerski@ucsb.edu

Recipes

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About

The Allied Polisher allows for bulk thinning of substrates, and fine polishing of optical waveguide facets. Various materials are typically lapped/polished, such as Silicon GaAs, InP.

Detailed Specs

  • Max. Substrate Size
  • Lapping Films available:
    • 10µm AlOx
    • 5µm AlOx
    • 2µm AlOx
    • 1µm AlOx
    • 0.5 AlOx

Operating Procedures

Recipes

  • To Be Added