Dicing Saw (ADT): Difference between revisions

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(Updated About section)
(Updated recipe recovery info)
 
(3 intermediate revisions by the same user not shown)
Line 30: Line 30:
==Operating Procedures==
==Operating Procedures==


*[https://wiki.nanofab.ucsb.edu/w/images/b/b0/ADT_SOP_Rev_I.pdf ADT Dicing Saw Standard Operating Procedure]
*[https://wiki.nanofab.ucsb.edu/w/images/5/54/ADT_SOP_Rev_J.pdf ADT Dicing Saw Standard Operating Procedure]
*[https://wiki.nanotech.ucsb.edu/w/images/0/01/Tape_Station_SOP_Rev_A.pdf Tape Station Standard Operating Procedure]
*[https://wiki.nanofab.ucsb.edu/w/images/5/5c/Post_Dicing_Tape_Expansion_SOP.pdf Post Dicing Tape Expansion]
*Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS
*[https://wiki.nanofab.ucsb.edu/w/images/5/5a/Ultron_1042R_Film_specs.pdf Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS]
*[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]]
*[https://wiki.nanofab.ucsb.edu/w/images/5/59/Recipe_Importing_New_Software.pdf Recovering an Old Recipe (2023)]




Latest revision as of 17:55, 24 September 2024

Dicing Saw (ADT)
ADT.jpg
Location Backend Lab: ESB 1111
Tool Type Packaging
Manufacturer Advanced Dicing Technologies Ltd.
Model ADT 7100
Description ADT Dicing Saw
Primary Supervisor Lee Sawyer
(805) 893-2123
lee_sawyer@ucsb.edu

Secondary Supervisor

Aidan Hopkins

Recipes
SignupMonkey: Sign up for this tool


About

The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.

Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples post dicing.

Contact Staff for blades and dicing frames for your group.

Detailed Specifications

  • Maximum Wafer Size: 8"
  • Parts mounted to UV-release tape for dicing
  • Automated cut maps at multiple angles (0° and 90° typical)
  • ~Few micron alignment to on-wafer features.
  • Thermocarbon Resnoid dicing blades provided by Staff

Operating Procedures


Recipes

Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.

Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Dicing_Saw_(ADT)&oldid=162374"