Dicing Saw (ADT): Difference between revisions

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==Operating Procedures==
==Operating Procedures==


*[https://wiki.nanofab.ucsb.edu/w/images/b/b0/ADT_SOP_Rev_I.pdf ADT Dicing Saw Standard Operating Procedure]
*[https://wiki.nanofab.ucsb.edu/w/images/5/54/ADT_SOP_Rev_J.pdf ADT Dicing Saw Standard Operating Procedure]
*[https://wiki.nanotech.ucsb.edu/w/images/0/01/Tape_Station_SOP_Rev_A.pdf Tape Station Standard Operating Procedure]
*[https://wiki.nanofab.ucsb.edu/w/images/5/5c/Post_Dicing_Tape_Expansion_SOP.pdf Post Dicing Tape Expansion]
*[https://wiki.nanofab.ucsb.edu/w/images/5/5a/Ultron_1042R_Film_specs.pdf Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS]
*[https://wiki.nanofab.ucsb.edu/w/images/5/5a/Ultron_1042R_Film_specs.pdf Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS]
*[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]]
*[https://wiki.nanofab.ucsb.edu/w/images/5/59/Recipe_Importing_New_Software.pdf Recovering an Old Recipe (2023)]




Latest revision as of 17:55, 24 September 2024

Dicing Saw (ADT)
ADT.jpg
Location Backend Lab: ESB 1111
Tool Type Packaging
Manufacturer Advanced Dicing Technologies Ltd.
Model ADT 7100
Description ADT Dicing Saw
Primary Supervisor Lee Sawyer
(805) 893-2123
lee_sawyer@ucsb.edu

Secondary Supervisor

Aidan Hopkins

Recipes
SignupMonkey: Sign up for this tool


About

The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.

Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples post dicing.

Contact Staff for blades and dicing frames for your group.

Detailed Specifications

  • Maximum Wafer Size: 8"
  • Parts mounted to UV-release tape for dicing
  • Automated cut maps at multiple angles (0° and 90° typical)
  • ~Few micron alignment to on-wafer features.
  • Thermocarbon Resnoid dicing blades provided by Staff

Operating Procedures


Recipes

Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.

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