Dicing Saw (ADT): Difference between revisions
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{{tool2|{{PAGENAME}} |
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|picture=ADT.jpg |
|picture=ADT.jpg |
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|type = Packaging |
|type = Packaging |
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|super= |
|super= Lee Sawyer |
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|super2= Aidan Hopkins |
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|phone= 805-893-3918x208 |
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|location= |
|location=Backend Lab: ESB 1111 |
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|email=hopkins@ece.ucsb.edu |
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|description = ADT Dicing Saw |
|description = ADT Dicing Saw |
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|model = ADT 7100 |
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|manufacturer = Advanced Dicing Technologies Ltd. |
|manufacturer = Advanced Dicing Technologies Ltd. |
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|materials = |
|materials = |
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|toolid=49 |
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}} |
}} |
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==About== |
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The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size. |
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Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock. |
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=Dicing Seminar= |
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*[[Media:ADT-Applications.pdf|Applications]] |
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An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples post dicing. |
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*[[Media:ADT-Blade-Part1.pdf|Dicing Blade Technical Seminar - Part 1]] |
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*[[Media:ADT-Blade-Part2.pdf|Dicing Blade Technical Seminar - Part 2]] |
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Contact Staff for blades and dicing frames for your group. |
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*[[Media:ADT-Blade-Part3.pdf|Dicing Blade Technical Seminar - Part 3]] |
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*[[Media:ADT-Dressing.pdf|Dressing]] |
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==Detailed Specifications== |
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*[[Media:ADT-Dressing-Requirements.pdf|Dressing requirements & Instructions per Application]] |
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*[[Media:ADT-MagneticHeadDicingProcess.pdf|Magnetic Head Dicing Process]] |
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*Maximum Wafer Size: 8" |
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*[[Media:ADT-QNF-Singulation.pdf|QNF Singulation]] |
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*Parts mounted to UV-release tape for dicing |
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*[[Media:ADT-Troubleshooting.pdf|Troubleshooting]] |
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*Automated cut maps at multiple angles (0° and 90° typical) |
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*~Few micron alignment to on-wafer features. |
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*Thermocarbon Resnoid dicing blades provided by Staff |
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==Operating Procedures== |
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*[https://wiki.nanofab.ucsb.edu/w/images/5/54/ADT_SOP_Rev_J.pdf ADT Dicing Saw Standard Operating Procedure] |
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*[https://wiki.nanofab.ucsb.edu/w/images/5/5c/Post_Dicing_Tape_Expansion_SOP.pdf Post Dicing Tape Expansion] |
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*[https://wiki.nanofab.ucsb.edu/w/images/5/5a/Ultron_1042R_Film_specs.pdf Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS] |
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*[https://wiki.nanofab.ucsb.edu/w/images/5/59/Recipe_Importing_New_Software.pdf Recovering an Old Recipe (2023)] |
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==Recipes== |
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*Recipes > Packaging > '''[[Packaging Recipes#Dicing Saw Recipes .28ADT 7100.29|Dicing Saw Recipes (ADT 7100)]]''' |
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Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting. |
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Revision as of 17:55, 24 September 2024
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About
The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.
Check the Dicing Saw Recipes page for the blades we currently stock.
An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples post dicing.
Contact Staff for blades and dicing frames for your group.
Detailed Specifications
- Maximum Wafer Size: 8"
- Parts mounted to UV-release tape for dicing
- Automated cut maps at multiple angles (0° and 90° typical)
- ~Few micron alignment to on-wafer features.
- Thermocarbon Resnoid dicing blades provided by Staff
Operating Procedures
- ADT Dicing Saw Standard Operating Procedure
- Post Dicing Tape Expansion
- Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS
- Recovering an Old Recipe (2023)
Recipes
- Recipes > Packaging > Dicing Saw Recipes (ADT 7100)
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.