Nanofab Job Postings: Difference between revisions

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(updated hiring dates to Spring 2025, added expansion into other cals.)
 
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''The following are positions we are currently hiring for:''
''The following are positions we are currently hiring for:''


===Intern - Processing Technician - Thin-Film Characterizations===
=== Process/Wafer Fab Engineer Level 2 (Staff Position) ===
Apply at this link: [https://careerspub.universityofcalifornia.edu/psp/ucsb/EMPLOYEE/HRMS/c/HRS_HRAM.HRS_APP_SCHJOB.GBL?Page=HRS_APP_JBPST&Action=U&FOCUS=Applicant&SiteId=31&JobOpeningId=65571&PostingSeq=1 jobs.ucsb.edu (#65571) - R&D Engineer Level 2]


*'''SPRING 2025 position specifically'''
* Under the supervision of a R&D3 Engineer, develops processes and establishes process control on a variety of nanofabrication research tools within the facility, including thin film deposition, inductively coupled plasma etching, and projection lithography.
*This position is for current UCSB Undergraduate students. Ideally in a technical field, optionally having taken one of the cleanroom course (neither are required).
* Works to establish and document standard procedures as well as new process modules for a variety of nanofabrication processes through direct hands-on processing and results documentation.
* Assigned work will support engineering staff, facility users, and facility projects.


*A position in the "[[Staff List#Process Group|Process Group]]", led by [[Demis D. John]].
===Process/Wafer Fab Engineer Level 3 (Staff position)===
*Running thin-film deposition calibrations on various high-use deposition tools, as listed on the [[Process Group - Process Control Data#Deposition .28Process Control Data.29|Deposition: Process Control data]].
Apply at this link: [https://careerspub.universityofcalifornia.edu/psp/ucsb/EMPLOYEE/HRMS/c/HRS_HRAM.HRS_APP_SCHJOB.GBL?Page=HRS_APP_JBPST&Action=U&FOCUS=Applicant&SiteId=31&JobOpeningId=60935&PostingSeq=1 jobs.ucsb.edu (# 60935): Research & Development Engineer level 3]
**These are user-accessible (public) charts and data that users consult to ensure the tools are operating as expected, and/or for troubleshooting problems in the fabrication process.
*May also transition into Lithography and Plasma-Etch calibrations over time.


===Intern - Processing Technician - Etch Characterizations===
*Process Development for Fab processes: Developing and executing fabrication processes for external customers and internal lab needs.
*Process Development for Lab equipment: Developing new recipes and designing/running DOE's for new/existing lab equipment.
*User Support: Giving fabrication advice to internal/external users.
*Process Control: Observing + Troubleshooting process drift/deviations, improving process repeatability.

==Filled Positions==

===1) Intern - Processing Technician - Thin-Film & Etch Characterizations===


*'''SPRING 2025 position specifically'''
*This position is for current UCSB Undergraduate students. Ideally in a technical field, optionally having taken one of the cleanroom course (neither are required).
*This position is for current UCSB Undergraduate students. Ideally in a technical field, optionally having taken one of the cleanroom course (neither are required).


*A position in the "[[Staff List#Process Group|Process Group]]", led by [[Demis D. John]].
*A position in the "[[Staff List#Process Group|Process Group]]", led by [[Demis D. John]].
*Running thin-film calibrations on various high-use deposition tools, as listed on the [[Process Group - Process Control Data#Deposition .28Process Control Data.29|Deposition: Process Control data]]. These are user-accessible (public) charts and data that users consult to ensure the tools are operating as expected, and/or for troubleshooting problems in the fabrication process.
*Running plasma etch calibrations and SEM on various high-use etch tools, as listed on the [[Process Group - Process Control Data#Etching .28Process Control Data.29|Etching: Process Control data]].
**These are user-accessible (public) charts and data that users consult to ensure the tools are operating as expected, and/or for troubleshooting problems in the fabrication process.
*May also transition into Lithography and Vacuum Deposition calibrations over time.

==Filled/Closed Positions==
''Process/Wafer Fab Engineer Level 2 (Staff Position)''
'''''We are no longer reviewing applications for this position'''''
''Apply at this link: [https://careerspub.universityofcalifornia.edu/psp/ucsb/EMPLOYEE/HRMS/c/HRS_HRAM.HRS_APP_SCHJOB.GBL?Page=HRS_APP_JBPST&Action=U&FOCUS=Applicant&SiteId=31&JobOpeningId=65571&PostingSeq=1 jobs.ucsb.edu (#65571) - R&D Engineer Level 2]''

*''Under the supervision of a R&D3 Engineer, develops processes and establishes process control on a variety of nanofabrication research tools within the facility, including thin film deposition, inductively coupled plasma etching, and projection lithography.''
*''Works to establish and document standard procedures as well as new process modules for a variety of nanofabrication processes through direct hands-on processing and results documentation.''
*''Assigned work will support engineering staff, facility users, and facility projects.''

===''Process/Wafer Fab Engineer Level 3 (Staff position)''===
'''''We are no longer reviewing applications for this position'''''
''Apply at this link: [https://careerspub.universityofcalifornia.edu/psp/ucsb/EMPLOYEE/HRMS/c/HRS_HRAM.HRS_APP_SCHJOB.GBL?Page=HRS_APP_JBPST&Action=U&FOCUS=Applicant&SiteId=31&JobOpeningId=60935&PostingSeq=1 jobs.ucsb.edu (# 60935): Research & Development Engineer level 3]''


*''Process Development for Fab processes: Developing and executing fabrication processes for external customers and internal lab needs.''
*''Process Development for Lab equipment: Developing new recipes and designing/running DOE's for new/existing lab equipment.''
*''User Support: Giving fabrication advice to internal/external users.''
*''Process Control: Observing + Troubleshooting process drift/deviations, improving process repeatability.''


==View all Nanofab Job Openings==
==View all Nanofab Job Openings==

Latest revision as of 00:44, 3 October 2024

You can see our Organization Chart here: https://www.nanotech.ucsb.edu/staff

Current Openings

The following are positions we are currently hiring for:

Intern - Processing Technician - Thin-Film Characterizations

  • SPRING 2025 position specifically
  • This position is for current UCSB Undergraduate students. Ideally in a technical field, optionally having taken one of the cleanroom course (neither are required).
  • A position in the "Process Group", led by Demis D. John.
  • Running thin-film deposition calibrations on various high-use deposition tools, as listed on the Deposition: Process Control data.
    • These are user-accessible (public) charts and data that users consult to ensure the tools are operating as expected, and/or for troubleshooting problems in the fabrication process.
  • May also transition into Lithography and Plasma-Etch calibrations over time.

Intern - Processing Technician - Etch Characterizations

  • SPRING 2025 position specifically
  • This position is for current UCSB Undergraduate students. Ideally in a technical field, optionally having taken one of the cleanroom course (neither are required).
  • A position in the "Process Group", led by Demis D. John.
  • Running plasma etch calibrations and SEM on various high-use etch tools, as listed on the Etching: Process Control data.
    • These are user-accessible (public) charts and data that users consult to ensure the tools are operating as expected, and/or for troubleshooting problems in the fabrication process.
  • May also transition into Lithography and Vacuum Deposition calibrations over time.

Filled/Closed Positions

Process/Wafer Fab Engineer Level 2 (Staff Position)

We are no longer reviewing applications for this position

Apply at this link: jobs.ucsb.edu (#65571) - R&D Engineer Level 2

  • Under the supervision of a R&D3 Engineer, develops processes and establishes process control on a variety of nanofabrication research tools within the facility, including thin film deposition, inductively coupled plasma etching, and projection lithography.
  • Works to establish and document standard procedures as well as new process modules for a variety of nanofabrication processes through direct hands-on processing and results documentation.
  • Assigned work will support engineering staff, facility users, and facility projects.

Process/Wafer Fab Engineer Level 3 (Staff position)

We are no longer reviewing applications for this position

Apply at this link: jobs.ucsb.edu (# 60935): Research & Development Engineer level 3

  • Process Development for Fab processes: Developing and executing fabrication processes for external customers and internal lab needs.
  • Process Development for Lab equipment: Developing new recipes and designing/running DOE's for new/existing lab equipment.
  • User Support: Giving fabrication advice to internal/external users.
  • Process Control: Observing + Troubleshooting process drift/deviations, improving process repeatability.

View all Nanofab Job Openings

To search for available NanoFab job positions, follow these instructions:

  1. Follow the appropriate link:
    1. Staff Jobs for "External Applicants" - not a current UCSB employee
    2. Staff Jobs for "Internal Applicants" - for current UCSB employees
  2. In the "keywords" search field, search for "NanoFab".
    • All available NanoFab job postings should be listed.

(The same can be done by going to https://www.jobs.ucsb.edu/ > scroll to Browse Jobs > Choose Internal or External applicant.)