Dry Etching Recipes: Difference between revisions

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(Text replacement - "/wiki/index.php/" to "/wiki/index.php?title=")
(Changed FICP Si to R6 and OXFD GaN to R3)
 
(66 intermediate revisions by 5 users not shown)
Line 1: Line 1:
===<u>[[Process Group - Process Control Data#Etching .28Process Control Data.29|Process Control Data]]</u>===
{{Recipe Table Explanation}}
<small>''See above [[Process Group - Process Control Data#Etching .28Process Control Data.29|linked page]] for [https://en.wikipedia.org/wiki/Statistical_process_control process control data] (dep rate/stress etc. over time), for a selection of often-used dry etches''</small>


===Dry Etching Tools/Materials Table===
''The Key/Legend for this table's <code>A...R6</code> values is at the [[Dry Etching Recipes#Process Ranking Table|bottom of the page]].''
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
|-
! colspan="15" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
|- bgcolor="#d0e7ff"
|- bgcolor="#d0e7ff"
| bgcolor="#eaecf0" |<!-- INTENTIONALLY LEFT BLANK -->
! colspan="18" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
! colspan="2" |'''[[RIE Etching Recipes|RIE Etching]]'''
! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
! colspan="4" bgcolor="#d0e7ff" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
|- bgcolor="#d0e7ff"
|- bgcolor="#d0e7ff"
|<!-- INTENTIONALLY LEFT BLANK -->
! colspan="3" |'''[[RIE Etching Recipes|RIE Etching]]'''
! colspan="6" |'''[[ICP Etching Recipes|ICP Etching]]'''
! colspan="5" bgcolor="#d0e7ff" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
|-
! bgcolor="#d0e7ff" align="center" |'''Material'''
! bgcolor="#d0e7ff" align="center" |'''Material'''
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> <span style="font-size: 88%;">(MRC)</span>]]
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> <span style="font-size: 88%;">(MRC)</span>]]
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> <span style="font-size: 88%;">(MRC)</span>]]
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#daf1ff" |[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Fluorine ICP <span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#daf1ff" |[[ICP Etching Recipes#PlasmaTherm.2FSLR Fluorine Etcher|Fluorine ICP <span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br><span style="font-size: 88%;">(Panasonic E626I)</span>]]
| bgcolor="#daf1ff" |[[ICP Etching Recipes#ICP Etch 1 .28Panasonic E646V.29|ICP Etch 1<br><span style="font-size: 88%;">(Panasonic E646V)</span>]]
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br><span style="font-size: 88%;">(Panasonic E640)</span>]]
| bgcolor="#daf1ff" |[[ICP Etching Recipes#ICP Etch 2 .28Panasonic E626I.29|ICP Etch 2<br><span style="font-size: 88%;">(Panasonic E626I)</span>]]
| bgcolor="#daf1ff" |[[ICP Etching Recipes#Oxford ICP Etcher .28PlasmaPro 100 Cobra.29|Oxford ICP <span style="font-size: 88%;">(PlasmaPro 100)</span>]]
| bgcolor="#daf1ff" |[[ICP Etching Recipes#Oxford ICP Etcher .28PlasmaPro 100 Cobra.29|Oxford ICP <span style="font-size: 88%;">(PlasmaPro 100)</span>]]
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br><span style="font-size: 88%;">(Unaxis VLR)</span>]]
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br><span style="font-size: 88%;">(Technics PEII)</span>]]
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br><span style="font-size: 88%;">(Technics PEII)</span>]]
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br><span style="font-size: 88%;">(Gasonics 2000)</span>]]
| bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean <span style="font-size: 88%;">(YES EcoClean)</span>]]
| bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean <span style="font-size: 88%;">(YES EcoClean)</span>]]
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
Line 44: Line 44:
|
|
|
|
|
|R1
|
|
|A
|- bgcolor="#ffffff"
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |Al
! bgcolor="#d0e7ff" align="center" |Al
|
|
|[[RIE Etching Recipes|R2]]
|
|
|[[RIE Etching Recipes|A]]
|
|
|{{rl|ICP Etching Recipes|Al Etch (Panasonic 1)|R1}}
|[[ICP Etching Recipes#Al Etch .28Panasonic 2.29|R2]]
|
|
|{{rl|ICP Etching Recipes|Al Etch (Panasonic 1)}}
|{{rl|ICP Etching Recipes|Al Etch (Panasonic 2)}}
|
|
|
|
Line 63: Line 60:
|
|
|
|
|
|R1
|
|
|A
|- bgcolor="#eeffff"
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |Au
! bgcolor="#d0e7ff" align="center" |Au
Line 82: Line 76:
|
|
|
|
|[[Other Dry Etching Recipes|R4]]
|
|
|
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
|- bgcolor="#ffffff"
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |Cr
! bgcolor="#d0e7ff" align="center" |Cr
|
|
|[[RIE Etching Recipes|R2]]
|
|A
|
|
|
|
|{{rl|ICP Etching Recipes|Cr Etch (Panasonic 1)}}
|{{rl|ICP Etching Recipes|Cr Etch (Panasonic 1)}}
|A
|R1
|
|
|
|
Line 102: Line 92:
|
|
|
|
|
|R1
|
|A
|- bgcolor="#eeffff"
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |Cu
! bgcolor="#d0e7ff" align="center" |Cu
Line 119: Line 107:
|
|
|
|
|
|R1
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |Ge
|
|
|
|
Line 124: Line 116:
|
|
|A
|A
|R1
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |Ge
|
|
|
|
Line 131: Line 122:
|
|
|
|
|[[Other Dry Etching Recipes|R2]]
|
|
|R1
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |Mo
|
|
|
|
Line 140: Line 135:
|
|
|
|
|A
|
|
|A
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |Mo
|
|
|
|
|
|
|
|
|R1
|-
!Nb
|
|
|
|
|
|
|
|
|A
|R1
|
|
|
|
Line 161: Line 157:
|
|
|
|
|A
|- bgcolor="#ffffff"
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |Ni
! bgcolor="#d0e7ff" align="center" |Ni
Line 177: Line 172:
|
|
|
|
|[[Other Dry Etching Recipes|R4]]
|-
!Os
|
|
|
|
|
|
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |Pt
|
|
|A
|R1
|
|
|
|
|
|
|
|
|
|
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |Pt
|
|
|
|
Line 199: Line 204:
|
|
|
|
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
|[[Other Dry Etching Recipes|R4]]
|- bgcolor="#ffffff"
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |Ru
! bgcolor="#d0e7ff" align="center" |Ru
|
|
|
|
|
Line 208: Line 212:
|
|
|A
|A
|{{Rl|ICP Etching Recipes|Ru (Ruthenium) Etch (Panasonic 2)}}
|[[ICP Etching Recipes#Ru .28Ruthenium.29 Etch .28Panasonic 2.29|R3]]
|
|
|
|
Line 216: Line 220:
|
|
|
|
|
|R1
|
|A
|- bgcolor="#eeffff"
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |Si
! bgcolor="#d0e7ff" align="center" |Si
|
|
|
|
|[[ICP Etching Recipes#DSEIII .28PlasmaTherm.2FDeep Silicon Etcher.29|R6]]
|[[ICP Etching Recipes#Si Etching .28Fluorine ICP Etcher.29|R6]]
|
|
|{{rl|ICP Etching Recipes|DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)}}
|{{Rl|ICP Etching Recipes|Si Etching}}
|
|
|R1
|
|
|A
|
|
|
|
|
|
|[[Other Dry Etching Recipes|R4]]
|
|R1
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |Ta
|
|
|
|
|
|
|{{rl|Other Dry Etching Recipes|Other Dry Etch (XeF2 Etcher)}}
|
|
|A
|A
|R1
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |Ta
|
|
|
|
Line 247: Line 252:
|
|
|
|
|R1
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |Ti
|
|
|
|
|
|
|
|
|{{rl|ICP Etching Recipes|Ti Etch (Panasonic 1)}}
|R1
|
|
|
|
Line 256: Line 266:
|
|
|
|
|A
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |Ti
|
|
|
|
|R1
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |W
|
|
|
|
|
|
|R2
|{{rl|ICP Etching Recipes|Ti Etch (Panasonic 1)}}
|{{rl|ICP Etching Recipes|W-TiW Etch (Panasonic 1)}}
|A
|R1
|
|
|
|
Line 273: Line 284:
|
|
|
|
|R1
|-
!TiW
|
|
|
|
|A
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |Al<sub>2</sub>O<sub>3</sub>
|
|
|R2
|
|
|R1
|
|
|
|
|
|
|
|[https://wiki.nanotech.ucsb.edu/wiki/index.php?title=ICP_Etching_Recipes#Al2O3_Etching_.28Panasonic_2.29 R]
|
|
|
|
Line 290: Line 301:
|
|
|
|
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |Al<sub>2</sub>O<sub>3</sub>
|
|
|
|
Line 295: Line 308:
|
|
|A
|A
|[[ICP Etching Recipes#Al2O3 Etching .28Panasonic 2.29|R3]]
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |Al<sub>2</sub>O<sub>3 (Sapphire)</sub>
|
|
|
|
Line 302: Line 314:
|
|
|
|
|{{rl|ICP Etching Recipes|Sapphire Etch (Panasonic 1)}}
|A
|
|
|
|
|R1
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |Al<sub>2</sub>O<sub>3 (Sapphire)</sub>
|
|
|
|
|
|
|
|
|{{rl|ICP Etching Recipes|Sapphire Etch (Panasonic 1)}}
|R1
|
|
|
|
|
|
|A
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |AlGaAs
|
|
|
|
|{{rl|RIE Etching Recipes|AlGaAs\GaAs Etching (RIE 5)}}
|
|
|
|
|R1
|{{rl|ICP Etching Recipes|AlGaAs Etch (Panasonic 1)}}
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |AlGaAs
|
|
|[[RIE Etching Recipes|R3]]
|
|
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|AlGaAs Etch (Unaxis VLR)}}
|
|
|{{rl|ICP Etching Recipes|GaAs-AlGaAs Etch (Panasonic 1)}}
|
|
|[[ICP Etching Recipes#GaAs Etch .28Oxford ICP Etcher.29|R3]]
|
|
|
|
Line 332: Line 347:
|
|
|
|
|A
|
|R1
|- bgcolor="#eeffff"
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |AlGaN
! bgcolor="#d0e7ff" align="center" |AlGaN
Line 341: Line 357:
|
|
|
|
|[[ICP Etching Recipes#GaN Etch .28Oxford ICP Etcher.29|R2]]
|
|
|
|
|{{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
|
|
|
|
|
|
|
|
|R1
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |AlN
|
|
|
|
|
|
|A
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |AlN
|
|
|
|
Line 361: Line 377:
|
|
|
|
|
|{{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
|
|
|
|
|
|
|R1
|-
!BCB
|
|
|
|
Line 371: Line 388:
|
|
|A
|A
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |CdZnTe
|{{rl|RIE Etching Recipes|CdZnTe Etch (RIE 2)}}
|
|
|
|
Line 383: Line 397:
|
|
|
|
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |CdZnTe
|[[RIE Etching Recipes|R3]]
|
|
|
|
Line 389: Line 406:
|
|
|
|
|A
|
|
|
|
|
|
|R1
|- bgcolor="#ffffff"
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |GaAs
! bgcolor="#d0e7ff" align="center" |GaAs
|
|
|[[RIE Etching Recipes|R4]]
|
|
|{{rl|RIE Etching Recipes|AlGaAs\GaAs Etching (RIE 5)}}
|
|
|{{rl|ICP Etching Recipes|GaAs-AlGaAs Etch (Panasonic 1)}}
|[[ICP Etching Recipes#GaAs Etch .28Panasonic 2.29|R3]]
|[[ICP Etching Recipes#GaAs Etch .28Oxford ICP Etcher.29|R2]]
|
|
|{{rl|ICP Etching Recipes|GaAs-AlGaAs_Etch_.28Panasonic_1.29}}
|{{rl|ICP Etching Recipes|GaAs Etch (Panasonic 2)}}
|A
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|GaAs Etch (Unaxis VLR)}}
|
|
|
|
Line 406: Line 428:
|
|
|
|
|
|R1
|
|A
|- bgcolor="#eeffff"
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |GaN
! bgcolor="#d0e7ff" align="center" |GaN
|
|
|[[RIE Etching Recipes|R4]]
|
|{{rl|RIE Etching Recipes|GaN Etching (RIE 5)}}
|
|
|
|
|{{rl|ICP Etching Recipes|GaN Etch (Panasonic 1)}}
|{{rl|ICP Etching Recipes|GaN Etch (Panasonic 1)}}
|R1
|[[ICP Etching Recipes#GaN Etch .28Oxford ICP Etcher.29|R3]]
|
|
|A
|{{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
|
|
|
|
Line 425: Line 444:
|
|
|
|
|
|R1
|
|A
|- bgcolor="#ffffff"
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |GaSb
! bgcolor="#d0e7ff" align="center" |GaSb
|
|
|
|
|
|
Line 437: Line 452:
|
|
|A
|A
|R1
|R1
|
|
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaSb Etch Unaxis VLR)}}
|
|
|
|
Line 444: Line 460:
|
|
|
|
|
|R1
|
|A
|- bgcolor="#eeffff"
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |HfO<sub>2</sub>
! bgcolor="#d0e7ff" align="center" |HfO<sub>2</sub>
Line 462: Line 476:
|
|
|
|
|
|R1
|
|
|A
|- bgcolor="#ffffff"
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |InGaAlAs
! bgcolor="#d0e7ff" align="center" |InGaAlAs
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
|[[RIE Etching Recipes|R4]]
|
|
|
|
Line 474: Line 485:
|
|
|
|
|R1
|
|
|A
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
|
|
|
|
Line 482: Line 492:
|
|
|
|
|
|R1
|
|A
|- bgcolor="#eeffff"
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |InGaAsP
! bgcolor="#d0e7ff" align="center" |InGaAsP
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
|[[RIE Etching Recipes|R4]]
|
|
|
|
Line 493: Line 501:
|
|
|
|
|[[ICP Etching Recipes#InP Ridge Etch .28Oxford ICP Etcher.29|R3]]
|
|
|R
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
|
|
|
|
Line 501: Line 508:
|
|
|
|
|
|R1
|
|A
|- bgcolor="#ffffff"
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |InP
! bgcolor="#d0e7ff" align="center" |InP
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
|[[RIE Etching Recipes|R4]]
|
|
|
|
|
|
|
|A
|A
|A
|R1
|[[ICP Etching Recipes#InP Ridge Etch .28Oxford ICP Etcher.29|R6]]
|R
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
|
|
|
|
|
Line 522: Line 524:
|
|
|
|
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
|[[Other Dry Etching Recipes|R4]]
|- bgcolor="#eeffff"
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |ITO
! bgcolor="#d0e7ff" align="center" |ITO
|{{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
|[[RIE Etching Recipes|R4]]
|
|
|
|
Line 538: Line 540:
|
|
|
|
|R1
|-
!LiNbO3
|
|
|
|
|
|
|A
|- bgcolor="#ffffff"
!Photoresist
& ARC
|
|
|A
|[https://wiki.nanotech.ucsb.edu/wiki/RIE_Etching_Recipes#Photoresist_and_ARC_.28RIE_5.29 R]
|
|
|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_.26_ARC_.28Fluorine_ICP_Etcher.29 R]
|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_and_ARC_Etching_.28Panasonic_1.29 R]
|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_and_ARC_etching_.28Panasonic_2.29 R]
|
|
|
|
|A
|A
|A
|
|
|
|
|
|
|
|
|A
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |SiC
|
|
|
|
|R1
|- bgcolor="#ffffff"
!Photoresist & Organics
|
|
|[[RIE Etching Recipes|R3]]
|
|
|[[ICP Etching Recipes#Photoresist .26 ARC .28Fluorine ICP Etcher.29|R3]]
|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_and_ARC_Etching_.28Panasonic_1.29 R]
|[[ICP Etching Recipes#Al2O3 Etching .28Panasonic 2.29|R3]]
|
|
|R3
|{{rl|ICP Etching Recipes|SiC Etch (Panasonic 1)}}
|[[Oxygen Plasma System Recipes#O2 Ashing|R3]]
|A
|[[Oxygen Plasma System Recipes#O2 Ashing|R3]]
|
|
|
|
|
|
|R1
|-
!ARC (Anti Reflective Coating)
|
|
|
|
|
|
|[[ICP Etching Recipes#Photoresist .26 ARC .28Fluorine ICP Etcher.29|R3]]
|
|
|
|
|
|
|A
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |SiN
|
|
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiN<sub>x</sub> Etching (RIE 3)}}
|
|
|
|
|
|
|{{rl|ICP Etching Recipes|SiNx Etching (Panasonic 1)}}
|{{rl|ICP Etching Recipes|SiNx Etching (Panasonic 2)}}
|
|
|
|
|A
|
|
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |SiC
|
|
|
|
|
|
|
|
|{{rl|ICP Etching Recipes|SiC Etch (Panasonic 1)}}
|R1
|
|
|A
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |SiO<sub>2</sub>
|
|
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiO<sub>2</sub> Etching (RIE 3)}}
|
|
|
|
|{{rl|ICP Etching Recipes|SiO2 Etching (Fluorine ICP Etcher)}}
|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 1)}}
|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 2)}}
|
|
|
|
|
|
|R1
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |SiN
|
|
|
|
|
|
|[[ICP Etching Recipes#Si3N4 Etching .28Fluorine ICP Etcher.29|R3]]
|{{rl|ICP Etching Recipes|SiNx Etching (Panasonic 1)}}
|[[ICP Etching Recipes#SiNx Etching .28Panasonic 2.29|R3]]
|
|
|[[Oxygen Plasma System Recipes#O2 Ashing|R3]]
|
|
|{{rl|Other Dry Etching Recipes|Other Dry Etch (Vapor HF Etcher)}}
|A
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |SiOxNy
|
|
|
|
|
|
|
|
|R1
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |SiO<sub>2</sub>
|
|
|A
|A
|
|
|
|
|[[ICP Etching Recipes#SiO2 Etching .28Fluorine ICP Etcher.29|R6]]
|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 1)}}
|[[ICP Etching Recipes#SiO2 Etching .28Panasonic 2.29|R6]]
|
|
|
|
Line 636: Line 635:
|
|
|
|
|[[Other Dry Etching Recipes|R4]]
|R1
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |SiOxNy
|
|
|A
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |Ta<sub>2</sub>O<sub>5</sub>
|
|
|
|
|
|
|A
|R1
|
|
|
|
|
|[https://www.osapublishing.org/optica/abstract.cfm?uri=optica-4-5-532 A]
|
|
|
|
Line 652: Line 652:
|
|
|
|
|R1
|-
!SU8
|
|
|
|
Line 657: Line 660:
|
|
|A
|A
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |TiN
|
|
|
|
Line 668: Line 669:
|
|
|
|
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |Ta<sub>2</sub>O<sub>5</sub>
|
|
|
|
|
|
|
|
|A
|R1
|
|
|
|
|
|
|A
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |TiO<sub>2</sub>
|
|
|
|
|
|
|
|
|R1
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |TiN
|
|
|
|
Line 694: Line 699:
|
|
|
|
|A
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |W-TiW
|
|
|R1
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |TiO<sub>2</sub>
|
|
|
|
|
|
|
|
|{{rl|ICP Etching Recipes|W-TiW Etch (Panasonic 1)}}
|A
|
|
|
|
Line 713: Line 716:
|
|
|
|
|A
|R1
|- bgcolor="#eeffff"
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |ZnO<sub>2</sub>
! bgcolor="#d0e7ff" align="center" |ZnO<sub>2</sub>
Line 729: Line 732:
|
|
|
|
|
|R1
|
|
|A
|- bgcolor="#ffffff"
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |ZnS
! bgcolor="#d0e7ff" align="center" |ZnS
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
|[[RIE Etching Recipes|R3]]
|
|
|
|
Line 748: Line 748:
|
|
|
|
|
|R1
|
|
|A
|- bgcolor="#eeffff"
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |ZnSe
! bgcolor="#d0e7ff" align="center" |ZnSe
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
|[[RIE Etching Recipes|R2]]
|
|
|
|
Line 767: Line 764:
|
|
|
|
|
|R1
|
|
|A
|- bgcolor="#ffffff"
|- bgcolor="#ffffff"
! bgcolor="#d0e7ff" align="center" |ZrO<sub>2</sub>
! bgcolor="#d0e7ff" align="center" |ZrO<sub>2</sub>
Line 786: Line 780:
|
|
|
|
|
|R1
|
|
|A
|- bgcolor="#eeffff"
|- bgcolor="#eeffff"
! bgcolor="#d0e7ff" align="center" |'''Material'''
! bgcolor="#d0e7ff" align="center" |'''Material'''
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> <span style="font-size: 88%;">(MRC)</span>]]
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> <span style="font-size: 88%;">(MRC)</span>]]
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> <span style="font-size: 88%;">(MRC)</span>]]
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#daf1ff" |[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Fluorine ICP <span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#daf1ff" |[[ICP Etching Recipes#PlasmaTherm.2FSLR Fluorine Etcher|Fluorine ICP <span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br><span style="font-size: 88%;">(Panasonic E626I)</span>]]
| bgcolor="#daf1ff" |[[ICP Etching Recipes#ICP Etch 1 .28Panasonic E646V.29|ICP Etch 1<br><span style="font-size: 88%;">(Panasonic E626I)</span>]]
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br><span style="font-size: 88%;">(Panasonic E640)</span>]]
| bgcolor="#daf1ff" |[[ICP Etching Recipes#ICP Etch 2 .28Panasonic E626I.29|ICP Etch 2<br><span style="font-size: 88%;">(Panasonic E640)</span>]]
| bgcolor="#daf1ff" |[[ICP Etching Recipes#Oxford ICP Etcher .28PlasmaPro 100 Cobra.29|Oxford ICP <span style="font-size: 88%;">(PlasmaPro 100)</span>]]
| bgcolor="#daf1ff" |[[ICP Etching Recipes#Oxford ICP Etcher .28PlasmaPro 100 Cobra.29|Oxford ICP <span style="font-size: 88%;">(PlasmaPro 100)</span>]]
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br><span style="font-size: 88%;">(Unaxis VLR)</span>]]
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br><span style="font-size: 88%;">(Technics PEII)</span>]]
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br><span style="font-size: 88%;">(Technics PEII)</span>]]
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br><span style="font-size: 88%;">(Gasonics 2000)</span>]]
| bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean <span style="font-size: 88%;">(YES EcoClean)</span>]]
| bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean <span style="font-size: 88%;">(YES EcoClean)</span>]]
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
Line 811: Line 799:
|}
|}


==='''Process Ranking Table'''===
Processes in the table above are ranked by their "''Process Maturity Level''" as follows:
{| class="wikitable"
!Process Level
! colspan="11" |Description of Process Level Ranking
|-
|A
| colspan="11" |Process '''A'''llowed and materials available but never done
|-
|R1
| colspan="11" |Process has been run at least once
|-
|R2
| colspan="11" |Process has been run and/or procedure is documented or/and data available
|-
|R3
| colspan="11" |Process has been run, procedure is documented, and data is available
|-
|R4
| colspan="11" |Process has a documented procedure with regular (≥4x per year) data '''or''' lookahead/in-situ control available
|-
|R5
| colspan="11" |Process has a documented procedure with regular (≥4x per year) data '''and''' lookahead/in-situ control available
|-
|R6
| colspan="11" |Process has a documented procedure, regular ( ≥4x per year) data, and control charts & limits available
|}
[[Category:Processing]]
[[Category:Processing]]

Latest revision as of 00:41, 22 October 2024

Process Control Data

See above linked page for process control data (dep rate/stress etc. over time), for a selection of often-used dry etches

Dry Etching Tools/Materials Table

The Key/Legend for this table's A...R6 values is at the bottom of the page.

Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 2
(MRC) 		RIE 5
(PlasmaTherm) 		DSEIII
(PlasmaTherm) 		Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E646V) 		ICP Etch 2
(Panasonic E626I) 		Oxford ICP (PlasmaPro 100) Ashers
(Technics PEII) 		Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
Ag R1
Al R2 R1 R2 R1
Au R4
Cr R2 R1 R1 R1
Cu R1
Ge A R1 R2 R1
Mo R1
Nb A R1
Ni R4
Os A R1
Pt R4
Ru A R3 R1
Si R6 R6 R1 R4 R1
Ta A R1 R1
Ti R1 R1 R1
W R2 R1 R1 R1
TiW R2 R1
Al2O3 A R3 R1
Al2O3 (Sapphire) R1 R1 R1
AlGaAs R3 R1 R3 R1
AlGaN R2 R1
AlN R1
BCB A
CdZnTe R3 R1
GaAs R4 R1 R3 R2 R1
GaN R4 R1 R1 R3 R1
GaSb A R1 R1 R1
HfO2 R1
InGaAlAs R4 R1 R1
InGaAsP R4 R3 R1
InP R4 A R1 R6 R4
ITO R4 R1
LiNbO3 R1
Photoresist & Organics R3 R3 R R3 R3 R3 R3 R1
ARC (Anti Reflective Coating) R3
SiC R1 R1 R1
SiN R3 R1 R3 R3 R1
SiO2 R6 R1 R6 R4 R1
SiOxNy A R1 R1
SU8 A
Ta2O5 A R1 R1
TiN R1
TiO2 R1
ZnO2 R1
ZnS R3 R1
ZnSe R2 R1
ZrO2 R1
Material RIE 2
(MRC) 		RIE 5
(PlasmaTherm) 		DSEIII
(PlasmaTherm) 		Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I) 		ICP Etch 2
(Panasonic E640) 		Oxford ICP (PlasmaPro 100) Ashers
(Technics PEII) 		Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)

Process Ranking Table

Processes in the table above are ranked by their "Process Maturity Level" as follows:

Process Level Description of Process Level Ranking
A Process Allowed and materials available but never done
R1 Process has been run at least once
R2 Process has been run and/or procedure is documented or/and data available
R3 Process has been run, procedure is documented, and data is available
R4 Process has a documented procedure with regular (≥4x per year) data or lookahead/in-situ control available
R5 Process has a documented procedure with regular (≥4x per year) data and lookahead/in-situ control available
R6 Process has a documented procedure, regular ( ≥4x per year) data, and control charts & limits available
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Dry_Etching_Recipes&oldid=162499"