Thermal Evap 2 (Solder): Difference between revisions

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! colspan=8 width=1300 height=35 bgcolor="#D0E7FF" align="center"|<div style="font-size: 150%;">Materials Table</div>
! colspan=6 width=1300 height=35 bgcolor="#D0E7FF" align="center"|<div style="font-size: 150%;">Materials Table</div>
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! width="45" bgcolor="#D0E7FF" align="center" | '''Material'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Material'''
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! width="45" bgcolor="#D0E7FF" align="center" | '''Z Ratio'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Z Ratio'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Tooling, %'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Tooling, %'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Current, Amp'''
! width="45" bgcolor="#D0E7FF" align="center" | '''Dep.rate, A/sec'''
! width="100" bgcolor="#D0E7FF" align="center" | '''Comments'''
! width="100" bgcolor="#D0E7FF" align="center" | '''Comments'''
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Revision as of 23:09, 28 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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Materials Table

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