Thermal Evap 2 (Solder): Difference between revisions

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|8.71
|8.71
|0.343
|0.343
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|Copper
|Cu
|8.93
|0.437
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|-
|Gallium
|Ga
|5.93
|0.593
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|-
|Gallium Arsenide
|GaAs
|5.31
|1.59
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Revision as of 23:29, 28 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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