Thermal Evap 2 (Solder): Difference between revisions

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Line 323: Line 323:
|6.47
|6.47
|1.18
|1.18
|
|
|-
|Silver chloride
|AgCl
|5.56
|1.32
|
|
|-
|Sodium
|Na
|0.97
|4.8
|
|
|-
|Sodium chloride
|NaCl
|2.17
|1.57
|
|
|-
|Tantalum
|Ta
|16.6
|0.262
|
|
|-
|Tantalum(IV) oxide
|Ta<sub>2</sub>O<sub>5</sub>
|8.2
|0.30
|
|
|
|

Revision as of 16:10, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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Materials Table