Thermal Evap 2 (Solder): Difference between revisions

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|8.2
|8.2
|0.30
|0.30
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|Tin
|Sn
|7.30
|0.724
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|-
|Titanium
|Ti
|4.50
|0.628
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|Titanium (IV) Oxide
|TiO<sub>2</sub>
|4.50
|0.628
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Revision as of 16:13, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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