Thermal Evap 2 (Solder): Difference between revisions

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Line 377: Line 377:
|Titanium (IV) Oxide
|Titanium (IV) Oxide
|TiO<sub>2</sub>
|TiO<sub>2</sub>
|4.50
|4.26
|0.628
|0.40
|
|
|-
|Titanium Oxide
|TiO
|4.90
|N/A
|
|
|-
|Tangsten
|W
|19.3
|0.163
|
|
|-
|Tangsten carbide
|WC
|15.6
|0.151
|
|
|-
|Zinc
|Zn
|7.04
|0.514
|
|
|-
|Zinc Oxide
|Zn
|5.61
|0.556
|
|
|-
|Zinc Sulfide
|ZnS
|4.09
|0.775
|
|
|-
|Zirconium
|Zr
|6.51
|0.60
|
|
|-
|Zirconium Oxide
|ZrO<sub>2</sub>
|5.6
|
|
|
|
|

Revision as of 16:20, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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Materials Table