Thermal Evap 2 (Solder): Difference between revisions

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Line 86: Line 86:
|0.775
|0.775
|
|
|Used often
|
|-
|-
|Carbon (graphite)
|Carbon (graphite)
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|0.305
|0.305
|155
|155
|Used often
|
|-
|-
|Cobalt
|Cobalt
Line 149: Line 149:
|0.841
|0.841
|120
|120
|USed often
|
|-
|-
|Indium antimonide
|Indium antimonide
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|0.331
|0.331
|
|
|Used often
|
|-
|-
|Niobium
|Niobium
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|0.724
|0.724
|
|
|USed often
|
|-
|-
|Titanium
|Titanium
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|0.628
|0.628
|
|
|Used often
|
|-
|-
|Titanium (IV) Oxide
|Titanium (IV) Oxide
Line 408: Line 408:
|0.514
|0.514
|
|
|Used often
|
|-
|-
|Zinc Oxide
|Zinc Oxide

Revision as of 18:23, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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