Thermal Evap 2 (Solder): Difference between revisions

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Line 389: Line 389:
|
|
|-
|-
|Tungsten
|Tangsten
|W
|W
|19.3
|19.3
Line 396: Line 396:
|
|
|-
|-
|Tangsten carbide
|Tungsten carbide
|WC
|WC
|15.6
|15.6
Line 408: Line 408:
|0.514
|0.514
|
|
|Used often; Density should be 7.14
|Used often
|-
|-
|Zinc Oxide
|Zinc Oxide
Line 417: Line 417:
|
|
|-
|-
|Zinc Sulphide
|Zinc Sulfide
|ZnS
|ZnS
|4.09
|4.09
Line 429: Line 429:
|0.60
|0.60
|
|
|Should be 6.40
|Should be 6.49
|-
|-
|Zirconium Oxide
|Zirconium Oxide
|ZrO<sub>2</sub>
|ZrO<sub>2</sub>
|5.6
|5.6
|1.001
|
|
|
|
|Should be 5.49
|-
|-

Revision as of 22:40, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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