Thermal Evap 2 (Solder): Difference between revisions

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Line 149: Line 149:
|0.841
|0.841
|120
|120
|USed often
|Used often
|-
|-
|Indium antimonide
|Indium antimonide
Line 385: Line 385:
|TiO
|TiO
|4.90
|4.90
|*1.00
|N/A
|
|
|
|* z ratio not established
|-
|-
|Tungsten
|Tungsten

Revision as of 22:42, 29 August 2012

Thermal Evap 2 (Solder)
Thermal2.jpg
Tool Type Vacuum Deposition
Location Bay 3
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Custom
Vacuum Deposition Recipes
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