Sputtering Recipes: Difference between revisions
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*[[media:22-TiO2-Film-Sputter-2.pdf|TiO2<sub>2</sub> Deposition Recipe]] |
*[[media:22-TiO2-Film-Sputter-2.pdf|TiO2<sub>2</sub> Deposition Recipe]] |
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=[[Sputter 3 (AJA ATC 2000-F)]]= |
=[[Sputter 3 (AJA ATC 2000-F)]]= |
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== Ni and Ta Deposition (Sputter 3) == |
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*[[media:|Ni and Ta Deposition Recipe]] |
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=[[Sputter 4 (AJA ATC 2200-V)]]= |
=[[Sputter 4 (AJA ATC 2200-V)]]= |
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== W Deposition (Sputter 4) == |
== W Deposition (Sputter 4) == |
Revision as of 19:23, 5 November 2013
Back to Vacuum Deposition Recipes.
Sputter 1 (Custom)
Sputter 2 (SFI Endeavor)
Al Deposition (Sputter 2)
AlNx Deposition (Sputter 2)
Au Deposition (Sputter 2)
TiO2 Deposition (Sputter 2)
Sputter 3 (AJA ATC 2000-F)
Ni and Ta Deposition (Sputter 3)
- [[media:|Ni and Ta Deposition Recipe]]
Sputter 4 (AJA ATC 2200-V)
W Deposition (Sputter 4)
Sputter 5 (Lesker AXXIS)
Ion Beam Deposition (Veeco NEXUS)
IBD Calibrations Spreadsheet - Records of historical film depositions (rates, indices), Uniformity etc.
All users are required to enter their calibration deps (simple test deps only)
SiO2 deposition (IBD)
- Refractive Index: ≈1.485
- Rate: ≈6.1nm/min (users must calibrate this prior to critical deps)
- Stress ≈ -320MPa (compressive)
Si3N4 deposition (IBD)
- Refractive Index ≈ 2.01
- Rate ≈ 4.5nm/min (users must calibrate this prior to critical deps)
- Stress ≈ -1756MPa (compressive)
Ta2O5 deposition (IBD)
- Refractive Index ≈ 2.10
- Rate ≈7.8nm/min (users must calibrate this prior to critical deps)
- Stress ≈ -140MPa (compressive)
TiO2 deposition (IBD)
- Refractive Index ≈ 2.3-2.4
- Rate ≈ 1.8nm/min
- Recipe: TiO2_dep